4
FN2924.8
Schematic Diagram
+10V RESPONSE +10V RESPONSE
T
A
= 25°C, R
S
= 50, R
L
= 100
PULSE RESPONSE
Test Circuits and Waveforms (Continued)
V
OUT
V
IN
0V
0V
T
A
= 25°C, R
S
= 50R
L
= 100
V
OUT
V
IN
0V
0V
T
A
= 25°C, R
S
= 50R
L
= 1k
V
OUT
V
IN
0V
0V
500mV
500mV
R
4
Q
15
Q
16
Q
19
R
6
Q
17
V+
Q
18
R
3
Q
13
Q
14
Q
12
Q
11
Q
3
Q
5
V
IN
R
5
V-
R
8
Q
4
R
9
Q
6
R
2
Q
10
Q
7
Q
8
R
1
R
13
Q
9
Q
2
R
10
R
11
Q
1
R
12
V
OUT
HA-5033
5
FN2924.8
Application Information
Layout Considerations
The wide bandwidth of the HA-5033 necessitates that high
frequency circuit layout procedures be followed. Failure to
follow these guidelines can result in marginal performance.
Probably the most crucial of the RF/video layout rules is the
use of a ground plane. A ground plane provides isolation and
minimizes distributed circuit capacitance and inductance
which will degrade high frequency performance. IC sockets
contribute inter-lead capacitance which limits device
bandwidth and should be avoided.
Pin 6 can be tied to either supply, grounded, or simply not used.
But to optimize device performance and improve isolation, it is
recommended that this pin be grounded.
Other considerations are proper power supply bypassing
and keeping the input and output connections as short as
possible which minimizes distributed capacitance and
reduces board space.
Power Supply Decoupling
For optimum device performance, it is recommended that
the positive and negative power supplies be bypassed with
capacitors to ground. Ceramic capacitors ranging in value
from 0.01F to 0.1F will minimize high frequency variations
in supply voltage. Solid tantalum capacitors 1F or larger will
optimize low frequency performance.
It is also recommended that the bypass capacitors be
connected close to the HA-5033 (preferably directly to the
supply pins).
Figure 5 is based on:
Where: T
JMAX
= Maximum Junction Temperature of the Device
T
A
= Ambient Temperature
JA
= Junction to Ambient Thermal Resistance
P
DMAX
T
JMAX
T
A
JA
-------------------------------
=
MAXIMUM TOTAL POWER DISSIPATION (W)
QUIESCENT P
D
= 0.72W
AT V
S
=
12V, I
CC
= 30mA
0.6
0.4
0.2
0
25
45
65 85
105
125
TEMPERATURE (°C)
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
FIGURE 5. MAXIMUM POWER DISSIPATION vs
TEMPERATURE
CAN
PDIP
Typical Applications (Also see Application Note AN548)
FIGURE 6. VIDEO COAXIAL LINE DRIVER 50 SYSTEM FIGURE 7. VIDEO GAIN BLOCK
R
L
RG -58
50
R
M
R
S
-12V
+12V
V
IN
5
12
10
0.1F
0.1F
11
50
75
VIDEO
75
OUTPUT
HA-5033
900
V-
V+
HA-2539
V-
V+
100
15
60
R
2
R
1
VIDEO
SIGNAL
INPUT
+
-
HA-5033
6
FN2924.8
POSITIVE PULSE RESPONSE
NEGATIVE PULSE RESPONSE
Typical Applications (Also see Application Note AN548) (Continued)
V
OUT
V
IN
0V
0V
T
A
= 25°C, R
S
= 50, R
M
= R
L
= 50
V
O
V
IN
R
L
R
L
R
M
+
----------------------
1
2
---
V
IN
==
V
OUT
V
IN
0V
0V
T
A
= 25°C, R
S
= 50, R
M
= R
L
= 50
V
O
V
IN
R
L
R
L
R
M
+
----------------------
1
2
---
V
IN
==
Typical Performance Curves
FIGURE 8. INPUT OFFSET VOLTAGE vs TEMPERATURE
FIGURE 9. INPUT BIAS CURRENT vs TEMPERATURE
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE FIGURE 11. SLEW RATE vs TEMPERATURE
8
7
6
5
4
-80 40 160
TEMPERATURE (°C)
OFFSET VOLTAGE (mV)
3
2
1
12080-40 0
V
S
= 12V
V
S
= 15V
V
S
= 10V
V
S
= 5V
40
30
20
-55 75 125
TEMPERATURE (°C)
INPUT BIAS CURRENT (A)
10
0
-25 25
V
S
= 15V
V
S
= 12V
V
S
= 5V
V
S
= 10V
30
20
10
0
-55 25 125
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
75-25
V
S
= 15V
V
S
= 12V
V
S
= 10V
V
S
= 5V
TEMPERATURE (°C)
3000
2000
1000
SLEW RATE (V/s)
V
S
= 15V, V
IN
= 10V
-55 75 125-25 25
FALL (R
L
= 1k)
FALL (R
L
= 100)
RISE (R
L
= 1k)
RISE (R
L
= 100)
HA-5033

HA3-5033-5

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
IC VIDEO BUFFER 250MHZ 8DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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