IXYS Reserves the Right to Change Limits, Test Conditions and Dimensions.
MMIX4B20N300
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
g
fS
I
C
= 20A, V
CE
= 10V, Note 1 11 18 S
C
ies
2230 pF
C
oes
V
CE
= 25V, V
GE
= 0V, f = 1MHz 92 pF
C
res
33 pF
Q
g
105 nC
Q
ge
I
C
= 20A, V
GE
= 15V, V
CE
= 1000V 13 nC
Q
gc
45 nC
t
d(on)
64 ns
t
r
210 ns
t
d(off)
300 ns
t
f
504 ns
t
d(on)
68 ns
t
r
540 ns
t
d(off)
300 ns
t
f
395 ns
R
thJC
0.83 °C/W
R
thCS
0.05 °C/W
R
thJA
30 °C/W
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Resistive Switching Times, T
J
= 125°C
I
C
= 20A, V
GE
= 15V
V
CE
= 1250V, R
G
= 10Ω
Resistive Switching Times, T
J
= 25°C
I
C
= 20A, V
GE
= 15V
V
CE
= 1250V, R
G
= 10Ω
Reverse Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
V
F
I
F
= 20A, V
GE
= 0V 2.1 V
t
rr
1.35 μs
I
RM
30 A
I
F
= 10A, V
GE
= 0V, -di
F
/dt = 100A/μs
V
R
= 100V, V
GE
= 0V
Notes:
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
2. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.