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VND830AEPTR-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
VND830AEP-E Package and PC board thermal data
Doc ID 11038 Rev 4 19/26
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 21. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 78 mm x 78 mm, PCB
thickness=2 mm, Cu thickness=70 mm (front and back side), Copper areas: from minimum
pad lay-out to 8 cm
2
).
Figure 22.
R
thj-amb
vs PCB copper area in open box free air condition (one channel ON)
40
45
50
55
60
0123456789
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)
Package and PC board thermal data VND830AEP-E
20/26 Doc ID 11038 Rev 4
Figure 23. PowerSSO-24 thermal impedance junction ambient single pulse (one
channel ON)
Figure 24. Thermal fitting model of a double channel HSD in PowerSSO-24
(b)
Equation 1
: pulse calculation formula
:
where δ = t
P
/T
b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
0.1
1
10
100
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
Footprint
8 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
VND830AEP-E Package and PC board thermal data
Doc ID 11038 Rev 4 21/26
Table 15. Thermal parameters
Area/island (cm
2
) Footprint 8
R1 = R7 (°C/W) 0.1
R2 = R8 (°C/W) 0.9
R3 (°C/W) 1
R4 (°C/W) 4
R5 (°C/W) 13.5
R6 (°C/W) 37 22
C1 = C7 (W.s/°C) 0.0006
C2 = C8 (W.s/°C) 0.0025
C3 (W.s/°C) 0.025
C4 (W.s/°C) 0.08
C5 (W.s/°C) 0.7
C6 (W.s/°C) 3 5
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26

VND830AEPTR-E

Mfr. #:
Buy VND830AEPTR-E
Manufacturer:
STMicroelectronics
Description:
Motor / Motion / Ignition Controllers & Drivers DBLE CH HI-SIDE DRVR
Lifecycle:
New from this manufacturer.
Delivery:
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