NB3U23C
http://onsemi.com
6
PACKAGE DIMENSIONS
UDFN6 1.2x1.4, 0.4P
CASE 517CW
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25MM FROM
THE TERMINAL TIP.
SEATING
PLANE
0.05 C
A3
A
A1
0.05 C
DIM
A
MIN MAX
MILLIMETERS
0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.20 BSC
E
1.40 BSC
e
0.40 BSC
L
---
0.15
L1
PIN ONE
REFERENCE
0.08 C
0.10 C
L
e
b
3
6
6X
1
4
BOTTOM VIEW
0.50 0.60
L1
DETAIL A
L
OPTIONAL TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTION
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.50
0.40
0.65
6X
DIMENSIONS: MILLIMETERS
0.26
PITCH
6X
1
PACKAGE
OUTLINE
RECOMMENDED
TOP VIEW
SIDE VIEW
DETAIL B
NOTE 4
DETAIL A
A
M
0.10 BC
M
0.05 C
D
E
A B
C
2X
2X
6X
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