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2N7002P,235
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
2N7002P
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 201
0. All rights rese
rved.
Product data sheet
Rev
. 02 —
29 July 2010
9 of 15
NXP Semiconductors
2N7002P
60 V
, 360 mA N-channel T
rench MOSFET
8.
T
est information
Fig 17.
Duty cycle definition
t
1
t
2
P
t
006aaa812
duty cycle
δ
=
t
1
t
2
2N7002P
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 201
0. All rights rese
rved.
Product data sheet
Rev
. 02 —
29 July 2010
10 of 15
NXP Semiconductors
2N7002P
60 V
, 360 mA N-channel T
rench MOSFET
9.
Package outline
Fig 18.
Package
outline SOT23 (TO-236AB)
UNIT
A
1
max.
b
p
cD
E
e
1
H
E
L
p
Qw
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
IEC
JEDEC
JEITA
mm
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
0.95
e
1.9
2.5
2.1
0.55
0.45
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23
TO-236AB
b
p
D
e
1
e
A
A
1
L
p
Q
detail X
H
E
E
w
M
v
M
A
B
A
B
0
1
2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface-mounted package; 3 leads
SOT2
3
2N7002P
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 201
0. All rights rese
rved.
Product data sheet
Rev
. 02 —
29 July 2010
1
1 of 15
NXP Semiconductors
2N7002P
60 V
, 360 mA N-channel T
rench MOSFET
10.
Soldering
Fig 19.
R
eflow solder
ing footprint fo
r SOT23 (TO-236AB)
Fig 20.
Wave sold
ering footprin
t for SOT23 (TO-236AB)
solder lands
solder resist
occupied are
a
solder paste
sot023_
fr
0.5
(3
×
)
0.6
(3
×
)
0.6
(3
×
)
0.7
(3
×
)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied are
a
preferred transport direction during soldering
sot023_
fw
2.8
4.5
1.4
4
.6
1.4
(2
×
)
1.2
(2
×
)
2.2
2.6
Dimensions in mm
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
2N7002P,235
Mfr. #:
Buy 2N7002P,235
Manufacturer:
Nexperia
Description:
MOSFET N-CH 60 V 360 mA
Lifecycle:
New from this manufacturer.
Delivery:
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