SI1428EDH-T1-GE3

Vishay Siliconix
Si1428EDH
New Product
Document Number: 67825
S11-0861-Rev. A, 02-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 30 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
•TrenchFET
®
Power MOSFET
Typical ESD Protection 2000 V HBM
100 % R
g
Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Portable Devices
- Load Switch
- Battery Switch
Load Switch for Motors, Relays and Solenoids
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A)
a
Q
g
(Typ.)
30
0.045 at V
GS
= 10 V 4
4 nC0.049 at V
GS
= 4.5 V 4
0.060 at V
GS
= 2.5 V 4
Notes:
a. Package limited, T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 125 °C/W.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 12
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
4
a
A
T
C
= 70 °C 4
a
T
A
= 25 °C
4
a, b, c
T
A
= 70 °C
3.7
b, c
Pulsed Drain Current (t = 300 µs)
I
DM
20
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
2.3
a
T
A
= 25 °C
1.3
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
2.8
W
T
C
= 70 °C 1.8
T
A
= 25 °C
1.56
b, c
T
A
= 70 °C
1.0
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
Marking Code
AS XX
Lot Traceability
and Date Code
Part # Code
YY
SOT-363
SC-70 (6-LEADS)
6
4
1
2
3
5
Top View
D
D
G
D
D
S
Ordering Information: Si1428EDH-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
S
G
R
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 5 s
R
thJA
60 80
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
34 45
www.vishay.com
2
Document Number: 67825
S11-0861-Rev. A, 02-May-11
Vishay Siliconix
Si1428EDH
New Product
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 30 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
23
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
- 3.2
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
0.6 1.3 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 4.5 V
± 0.5
µA
V
DS
= 0 V, V
GS
= ± 12 V
± 25
Zero Gate Voltage Drain Current I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 4.5 V 15 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 3.7 A 0.036 0.045
V
GS
= 4.5 V, I
D
= 3.6 A 0.040 0.049
V
GS
= 2.5 V, I
D
= 1.5 A 0.048 0.060
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 3.7 A 17 S
Dynamic
b
Total Gate Charge Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 4.7 A 8.8 13.5
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 4.7 A
46
Gate-Source Charge Q
gs
0.9
Gate-Drain Charge Q
gd
1.1
Gate Resistance R
g
f = 1 MHz 0.4 2 4 k
Tur n - O n D e l ay Time t
d(on)
V
DD
= 15 V, R
L
= 4.1
I
D
3.7 A, V
GEN
= 4.5 V, R
g
= 1
0.29 0.58
µs
Rise Time t
r
0.4 0.8
Turn-Off DelayTime t
d(off)
1.9 3.8
Fall Time t
f
0.75 1.5
Tur n - O n D e l ay T im e t
d(on)
V
DD
= 15 V, R
L
= 4.1
I
D
3.7 A, V
GEN
= 10 V, R
g
= 1
0.1 0.2
Rise Time t
r
0.15 0.3
Turn-Off DelayTime t
d(off)
36
Fall Time t
f
0.75 1.5
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 °C 2.3
A
Pulse Diode Forward Current I
SM
20
Body Diode Voltage V
SD
I
S
= 3.7 A, V
GS
= 0 V 0.85 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= 3.7 A, dI/dt = 100 A/µs, T
J
= 25 °C
12 25 ns
Body Diode Reverse Recovery Charge Q
rr
510 nC
Reverse Recovery Fall Time t
a
6.5
ns
Reverse Recovery Rise Time t
b
5.5
Document Number: 67825
S11-0861-Rev. A, 02-May-11
www.vishay.com
3
Vishay Siliconix
Si1428EDH
New Product
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Gate Current vs. Gate-to-Source Voltage
Output Characteristics
On-Resistance vs. Drain Current
0
10
20
30
40
0 3 6 9 12 15 18
I
GSS
- Gate Current (mA)
V
GS
- Gate-Source Voltage (V)
T
J
= 25 °C
0
4
8
12
16
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
V
GS
= 1.5 V
V
GS
= 2.5 V
V
GS
= 5 V thru 3 V
V
GS
= 2 V
0
0.04
0.08
0.12
0.16
0 4 8 12 16 20
R
DS(on)
- On-Resistance (Ω)
I
D
-Drain Current (A)
V
GS
= 4.5 V
V
GS
= 2.5 V
V
GS
= 10 V
Gate Current vs. Gate-to-Source Voltage
Transfer Characteristics
Gate Charge
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
0 3 6 9 12 15 18
I
GSS
- Gate Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
J
= 150 °C
T
J
= 25 °C
0
2
4
6
8
10
0.0 0.5 1.0 1.5 2.0 2.5
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
0
2
4
6
8
10
0 2 4 6 8 10
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
DS
= 7.5 V
V
DS
= 24 V
I
D
= 4.7 A
V
DS
= 15 V

SI1428EDH-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 78-SI1416EDH-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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