DATA SHEET • SKY65135 WLAN PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
10 March 28, 2007 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 200436D
S965
Stencil Aperture
Top View
Metallization
Top View
Solder Mask Opening
Top View
6.3
2X 1.7
6.3
1.0 Typical
6.4
6.4
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening.
Component outline
Pin 1
Component outline
All measurements are in millimeters
20X 0.85
20X 0.6
Thermal Via Array ∅0.3 mm
on 0.6 mm pitch.
Additional vias will improve
thermal performance.
Note: Thermal vias should be tented and filled with
solder mask: 30 to 35 µm Cu plating recommended.
6.3
1.0 Typical
1.0 Typical
2X 1.7
2X 1.7
6.3
0.6 Typical
Component outline
2X 1.7
20X 0.5
20X 0.75
20X 0.5
20X 0.75
0.25 Typical
0.6 Typical
Pin 20
Pin 1
Pin 20
Pin 1
Pin 20
Figure 16. SKY65135 Phone Board Layout Footprint
