NCN8024R
http://onsemi.com
7
HOST INTERFACE SECTION CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc, CLKDIV1, CLKDIV2, CMDVCC, 5V/3V
(V
DD
= 3.3 V; V
DDP
= 5 V; T
amb
= 25°C; F
CLKIN
= 10 MHz)
Symbol Rating Min Typ Max Unit
F
CLKIN
Clock Frequency on Pin CLKIN (with Divider Ratio w 2) (Note 6) 27 MHz
V
IL
Input Voltage Level Low: CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc, CLKDIV1,
CLKDIV2, CMDVCC, 5V/3V
0.3 0.3 x V
DD
V
V
IH
Input Voltage Level High: CLKIN, RSTIN, I/O, AUX1, AUX2, CLKDIV1, CLKDIV2,
CMDVCC, 5V/3V
0.7 x V
DD
V
DD
+ 0.3 V
|I
IL
| CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, 5V/3V Low Level Input Leakage
Current, V
IL
= 0 V
1.0
mA
|I
IH
| CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, 5V/3V Low Level Input Leakage
Current, V
IH
= V
DD
1.0
mA
V
IL
Input Voltage Level Low: I/Ouc, AUX1uc, AUX2uc 0.3
0.5
V
V
IH
Input Voltage Level High: I/Ouc, AUX1uc, AUX2uc 0.7 x V
DD
V
DD
+ 0.3 V
|I
IL
| I/Ouc, AUX1uc, AUX2uc Low Level Input Leakage Current, V
IL
= 0 V 600
mA
|I
IH
| I/Ouc, AUX1uc, AUX2uc High Level Input Leakage Current, V
IH
= V
DD
10
mA
V
OH
V
OL
t
Ri/Fi
t
Ro/Fo
I/Ouc, AUX1uc, AUX2uc data channels, @ Cs v 30 pF
High Level Output Voltage (CRD_I/O = CRD_AUX1 = CRD_AUX2 = CRD_V
CC
)
I
OH
= 0
I
OH
= 40 mA for V
DD
> 2 V (I
OH
= 20 mA for V
DD
2 V)
Low Level Output Voltage (CRD_I/O= CRD_AUX1 = CRD_AUX2 = 0 V)
I
OL
= +1 mA
Input Rising/Falling Times (Note 6)
Output Rising/Falling Times (Note 6)
0.9 x V
DD
0.75 x V
DD
0
V
DD
+ 0.1
V
DD
+ 0.1
0.3
1.2
0.1
V
V
V
ms
ms
F
bidi
Maximum Frequency through Bidirectional I/O, AUX1 and AUX2 Channels (Note 6) 1 MHz
R
pu
I/0uc, AUX1uc, AUX2uc Pullup Resistor 8.0 11 16
kW
V
OH
Output High Voltage
INT @ I
OH
= 15 mA (Source)
0.6 x V
DD
V
V
OL
Output Low Voltage
INT @ I
OL
= 2 mA (Sink) 0 0.30
V
R
INT
INT Pullup Resistor 40 50 60
kW
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
6. Guaranteed by design and characterization
NCN8024R
http://onsemi.com
8
SMART CARD INTERFACE SECTION, CRD_IO, CRD_AUX1, CRD_AUX2, CRD_CLK, CRD_RST, CRD_PRES,
CRD_PRES
(V
DD
= 3.3 V; V
DDP
= 5 V; T
amb
= 25°C; F
CLKIN
= 10 MHz)
Symbol Rating Min Typ Max Unit
V
OH
V
OL
V
OH
V
OL
t
R
t
F
t
d
CRD_RST @ CRD_V
CC
= 3.0 V, 5.0 V
Output RESET V
OH
@ I
rst
= 200 mA
Output RESET V
OL
@ I
rst
= 200 mA
Output RESET V
OH
@ I
rst
= 20 mA
Output RESET V
OL
@ I
rst
= 20 mA
Output RESET Risetime @ C
out
= 100 pF (Note 7)
Output RESET Falltime @C
out
= 100 pF (Note 7)
RSTIN to CRD_RST Delay Reset Enabled (Note 7)
0.9 x CRD_V
CC
0
0
CRD_V
CC
0.4
CRD_V
CC
0.20
0.4
CRD_V
CC
100
100
2
V
V
V
V
ns
ns
ms
F
CRDCLK
V
OH
V
OL
V
OH
V
OL
F
DC
t
rills
t
ulsa
SR
CRD_CLK @ CRD_V
CC
= 3.0 V or 5.0 V
Output Frequency (Note 7)
Output CRD_CLK V
OH
@ I
clk
= 200 mA
Output CRD_CLK V
OL
@ I
clk
= 200 mA
Output CRD_CLK V
OH
@ I
clk
= 70 mA
Output CRD_CLK V
OL
@ I
clk
= 70 mA
Output Duty Cycle (Note 7)
Rise & Fall time (Note 5)
Output CRD_CLK Risetime @ C
out
= 30 pF
Output CRD_CLK Falltime @ C
out
= 30 pF
Slew Rate @ Cout = 33 pF (Note 7)
0.9 x CRD_V
CC
0
0
CRD_V
CC
0.4
45
0.2
18
CRD_V
CC
+0.2
0.4
CRD_V
CC
55
16
16
MHz
V
V
V
V
%
ns
ns
V/ns
V
IH
V
IH
V
IL
I
IL
I
IH
V
OH
V
OL
t
Ri/Fi
t
Ro/Fo
CRD_AUX1, CRD_AUX2, CRD_IO @ CRD_V
CC
= 3.0 V, 5.0 V
Input Voltage High Level (5 V Mode)
Input Voltage High Level (3 V Mode)
Input Voltage Low Level
Low Level Input Current V
IL
= 0 V
High Level Input Current V
IH
= CRD_V
CC
Output V
OH
@ I
OH
= 40 mA
Output V
OL
@ I
OL
= 1 mA, V
IL
= 0 V
Input Rising/Falling Times
Output Rising/Falling Times / C
out
= 80 pF
2.3
1.6
0.30
0.75 x CRD_V
CC
0
CRD_V
CC
+0.3
CRD_V
CC
+0.3
0.80
600
10
CRD_V
CC
+0.1
0.30
1.2
0.1
V
V
V
mA
mA
V
V
ms
ms
R
PU
CRD_AUX1, CRD_AUX2, CRD_IO Pullup Resistor 8.0 11 16
kW
t
IO
Propagation delay I
Ouc
> CRD_IO and CRD_IO > IOuc (Falling
Edge) (Note 7)
200 ns
t
pu
Active pullup pulse width buffers I/O, AUX1 & AUX2 (Note 7) 200 ns
V
IH
V
IL
CRD_PRES, CRD_PRES
Card Presence Voltage High Level
Card Presence Voltage Low Level
0.7 x V
DD
0.3
V
DD
+ 0.3
0.3 x V
DD
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
7. Guaranteed by design and characterization
NCN8024R
http://onsemi.com
9
SMART CARD INTERFACE SECTION, CRD_IO, CRD_AUX1, CRD_AUX2, CRD_CLK, CRD_RST, CRD_PRES,
CRD_PRES
(V
DD
= 3.3 V; V
DDP
= 5 V; T
amb
= 25°C; F
CLKIN
= 10 MHz)
Symbol UnitMaxTypMinRating
|I
IH
|
|I
IL
|
CRD_PRES, CRD_PRES
High level input leakage current, V
IH
= V
DD
CRD_PRES
CRD_PRES
Low level input leakage current, V
IL
= 0 V
CRD_PRES
CRD_PRES
3
3
10
1
1
10
mA
T
debounce
Debounce Time CRD_PRES and CRD_PRES (Note 7) 5 8 12 ms
I
CRD_IO
CRD_IO, CRD_AUX1, CRD_AUX2 Current Limitation 15 mA
I
CRD_CLK
CRD_CLK Current Limitation 70 mA
I
CRD_RST
CRD_RST Current Limitation 20 mA
t
act
Activation Time (Note 7) 30 100
ms
t
deact
Deactivation Time (Note 7) 30 250
ms
Temp
SD
Shutdown Temperature 160 °C
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
7. Guaranteed by design and characterization
POWER SUPPLY
The NCN8024R smart card interface has two power
supplies: V
DD
and V
DDP
.
V
DD
is usually common to the system controller and the
interface. The applied V
DD
ranges from 2.7 V up to 5.5 V.
If V
DD
goes below 2.30 V typical (UVLO
VDD
) a
powerdown sequence is automatically performed. In that
case the interrupt (INT) pin is set Low.
A Low DropOut (LDO) and low noise regulator is used
to provide the 3 V or 5 V power supply voltage (CRD_V
CC
)
to the card. VDDP is the LDO’s input voltage. CRD_V
CC
is
the LDO output. The typical distributed reservoir output
capacitor connected to CRD_V
CC
is 100 nF + 220 nF. To
minimize dI/dt effects the capacitor of 100 nF is connected
as close as possible to the CRD_V
CC
s pin and the 220 nF
one as close as possible to the card connector C1 pin. Both
feature very low ESR values (lower than 50 mW). The
decoupling capacitors on V
DD
and V
DDP
respectively
100 nF and 10 mF have also to be connected close to the
respective IC pins.
The CRD_VCC pin can source up to 70 mA continuously
over the VDDP range, the absolute maximum current being
internally limited below 150 mA (Typical at 120 mA).
There’s no specific sequence for applying V
DD
or V
DDP
.
They can be applied to the interface in any sequence. After
powering the device INT pin remains Low until a card is
inserted.
SUPPLY VOLTAGE MONITORING
The supply voltage monitoring block includes the Power
On Reset (POR) circuitry and the under voltage lockout
(UVLO) detection (V
DD
voltage dropout detection).
PORADJ pin allows the user, according to the considered
application, to adjust the V
DD
UVLO threshold. If not used
PORADJ pin is connected to Ground (recommended even
if it may be left unconnected).
The input supply voltage is continuously monitored to
prevent under voltage operation. At power up, the system
initializes the internal logic during POR timing and no
further signal can be provided or supported during this
period.
The system is ready to operate when the input voltage has
reached the minimum V
DD
. Considering this, the
NCN8024R will detect an UnderVoltage situation when
the input supply voltage will drop below 2.30 V typical.
When V
DD
goes down below the UVLO falling threshold a
deactivation sequence is performed.
The device is inactive during poweron and poweroff of
the V
DD
supply (8 ms reset pulse).
PORADJ pin is used to modify the UVLO threshold
according to the below relationship considering an external
resistor divider R1 / R2 (see block diagram Figure 1):
UVLO +
R1 ) R2
R2
V
POR
If PORADJ is connected to Ground the V
DD
UVLO
threshold (V
DD
falling) is typically 2.30 V. In some cases it
can be interesting to adjust this threshold at a higher value
and by the way increase the V
DD
supply dropout detection
level which enables a deactivation sequence if the V
DD
voltage is too low.
For example, there are microcontrollers for which the
minimum supply voltage insuring a correct operating is
higher than 2.70 V, increasing UVLO
VDD
(V
DD
falling) is
consequently necessary. Considering for instance a resistor

NCN8024RDWGEVB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Interface - Specialized
Lifecycle:
New from this manufacturer.
Delivery:
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