MC100EP809FAR2

© Semiconductor Components Industries, LLC, 2015
April, 2015 − Rev. 10
1 Publication Order Number:
MC100EP809/D
MC100EP809
3.3V 2:1:9 Differential
HSTL/PECL/LVDS to HSTL
Clock Driver with LVTTL
Clock Select and Enable
Description
The MC100EP809 is a low skew 2:1:9 differential clock driver,
designed with clock distribution in mind, accepting two clock sources
into an input multiplexer. The part is designed for use in low voltage
applications which require a large number of outputs to drive precisely
aligned low skew signals to their destination. The two clock inputs are
one differential HSTL and one differential LVPECL. Both input pairs
can accept LVDS levels. They are selected by the CLK_SEL pin
which is LVTTL. To avoid generation of a runt clock pulse when the
device is enabled/disabled, the Output Enable (OE), which is LVTTL,
is synchronous ensuring the outputs will only be enabled/disabled
when they are already in LOW state (Figure 9).
The MC100EP809 guarantees low output−to−output skew. The
optimal design, layout, and processing minimize skew within a device
and from lot to lot. The MC100EP809 output structure uses open
emitter architecture and will be terminated with 50 to ground
instead of a standard HSTL configuration (Figure 7). To ensure the
tight skew specification is realized, both sides of the differential output
need to be terminated identically into 50 even if only one output is
being used. If an output pair is unused, both outputs may be left open
(unterminated) without affecting skew.
Designers can take advantage of the EP809’s performance to
distribute low skew clocks across the backplane of the board. Both
clock inputs may be single−end driven by biasing the non−driven pin
in an input pair (Figure 8).
Features
100 ps Typical Device−to−Device Skew
15 ps Typical within Device Skew
HSTL Compatible Outputs Drive 50 to GND with no
Offset Voltage
Maximum Frequency > 750 MHz
850 ps Typical Propagation Delay
Fully Compatible with Micrel SY89809L
PECL and HSTL Mode Operating Range: V
CCI
= 3 V to 3.6 V
with GND = 0 V, V
CCO
= 1.6 V to 2.0 V
Open Input Default State
These Devices are Pb−Free and are RoHS Compliant
32
1
MC100
AWLYYWWG
EP809
32−LEAD LQFP
FA SUFFIX
CASE 873A
MARKING
DIAGRAMS*
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
www.
onsemi.com
32
1
MC100
EP809
AWLYYWWG
G
1
QFN32
MN SUFFIX
CASE 488AM
MC100EP809
www.onsemi.com
2
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26
27
28
29
30
31
32
15
14
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12
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9
12345678
24 23 22 21 20 19 18 17
16
All V
CCI
, V
CCO
, and GND pins must be externally connected to
appropriate Power Supply to guarantee proper operation (V
CCI
0 V
CCO
).
Figure 1. 32−Lead LQFP Pinout (Top View)
V
CCI
HSTL_CLK
HSTL_CLK
CLK_SEL
LVPECL_CLK
LVPECL_CLK
GND
OE
V
CCO
V
CCO
Q3
Q3
Q4
Q4
Q5
Q5
Q2
V
CCO
Q2
Q1
Q1
Q0
Q0
V
CCO
V
CCO
Q6
Q6
Q7
Q7
Q8
Q8
V
CCO
MC100EP809
2526272829303132
1514131211109
1
2
3
4
5
6
7
8
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21
20
19
18
17
16
Figure 2. 32−Lead QFN Pinout (Top View)
V
CCI
HSTL_CLK
HSTL_CLK
CLK_SEL
LVPECL_CLK
LVPECL_CLK
GND
OE
V
CCO
V
CCO
Q3
Q3
Q4
Q4
Q5
Q5
Q2
V
CCO
Q2
Q1
Q1
Q0
Q0
V
CCO
V
CCO
Q6
Q6
Q7
Q7
Q8
Q8
V
CCO
MC100EP809
Exposed Pad
(EP)
MC100EP809
www.onsemi.com
3
Table 1. PIN DESCRIPTION
PIN FUNCTION
HSTL_CLK*,
HSTL_CLK
**
HSTL or LVDS Differential Inputs
LVPECL_CLK*,
LVPECL_CLK
**
LVPECL or LVDS Differential Inputs
CLK_SEL** LVCMOS/LVTTL Input CLK Select
OE** LVCMOS/LVTTL Output Enable
Q0 − Q8,
Q0
− Q8
HSTL Differential Outputs
V
CC1
Positive Supply_Core
(3.0 V − 3.6 V)
V
CC0
Positive Supply_HSTL Outputs
(1.6 V − 2.0 V)
GND Ground
EP The exposed pad (EP) on the QFN−32
package bottom is thermally connected to
the die for improved heat transfer out of the
package. THe exposed pad must be at-
tached to a heat−sinking conduit. The pad
is electrically connected to GND.
* Pins will default LOW when left open.
** Pins will default HIGH when left open.
Table 2. TRUTH TABLE
OE* CLK_SEL Q0 − Q8 Q0 − Q8
L L L H
L H L H
H L HSTL_CLK HSTL_CLK
H H LVPECL_CLK LVPECL_CLK
*The OE (Output Enable) signal is synchronized with the rising edge
of the HSTL_CLK and LVOCL_CLK signals.
0
1
Figure 3. Logic Diagram
CLK_SEL
HSTL_CLK
HSTL_CLK
LVPECL_CLK
LVPECL_CLK
OE
Q0−Q8 (HSTL)
Q0
−Q8 (HSTL)
Q
D
9
9
V
CCI
GND
V
CCO
Table 3. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor
75 k
Internal Input Pullup Resistor
37.5 k
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pkg
LQFP−32
QFN−32
Level 2
N/A
Level 2
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 478 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.

MC100EP809FAR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC CLK BUFFER 1:9 750MHZ 32LQFP
Lifecycle:
New from this manufacturer.
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