PSMN035-150B_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 17 November 2009 3 of 12
NXP Semiconductors
PSMN035-150B
N-channel TrenchMOS SiliconMAX standard level FET
Fig 1. Normalized continuous drain current as a
function of mounting base temperature
Fig 2. Safe operating area; continuous and peak drain
currents as a function of drain-source volt
Fig 3. Normalized total power dissipation as a
function of mounting base temperature
Fig 4. Non-repetitive avalanche ruggedness current
as a function of pulse duration
T
mb
(°C)
0 20015050 100
03aa24
40
80
120
I
der
(%)
0
110
10
2
10
3
V
DS
(V)
1
10
10
2
10
3
I
D
(A)
10 ms
R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10 μs
100 μs
t
p
t
p
T
P
t
T
d =
D.C.
003aaa016
100 ms
T
mb
(°C)
0 20015050 100
03aa16
40
80
120
P
der
(%)
0
10
3
10
2
10
1
110
t
p
(ms)
1
10
10
2
I
AS
(A)
T
j
prior to avalanche = 150 °C
25 °C
003aaa017
PSMN035-150B_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 17 November 2009 4 of 12
NXP Semiconductors
PSMN035-150B
N-channel TrenchMOS SiliconMAX standard level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting
base
see Figure 5 - 0.6 - K/W
R
th(j-a)
thermal resistance from
junction to ambient
mounted on printed-circuit board;
minimum footprint
--50K/W
Fig 5. Transient thermal impedance from junction to solder point as a function of pulse duration
003aaa018
t
p
(s)
10
6
10
1
110
2
10
3
10
5
10
4
10
1
10
2
1
Z
th(j-mb)
(K/W)
10
3
t
p
t
p
T
P
t
T
δ =
δ = 0.5
0.02
0.05
0.2
0.1
Single Pulse
PSMN035-150B_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 17 November 2009 5 of 12
NXP Semiconductors
PSMN035-150B
N-channel TrenchMOS SiliconMAX standard level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
=25A; V
GS
=0V; T
j
=2C 150 - - V
V
GS(th)
gate-source threshold
voltage
I
D
=1mA; V
DS
= V
GS
; T
j
= 175 °C;
see Figure 10
1- - V
I
D
=1mA; V
DS
= V
GS
; T
j
=2C;
see Figure 10
234V
I
DSS
drain leakage current V
DS
=150V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
V
DS
=150V; V
GS
=0V; T
j
= 175 °C - - 500 µA
I
GSS
gate leakage current V
GS
=10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
= 175 °C;
see Figure 11 and 12
--98m
V
GS
=10V; I
D
=25A; T
j
=2C;
see Figure 11
and 12
-3035m
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=50A; V
DS
=120V; V
GS
=10V;
T
j
=2C; see Figure 13
-79-nC
Q
GS
gate-source charge - 17 - nC
Q
GD
gate-drain charge - 33 45 nC
C
iss
input capacitance V
DS
=25V; V
GS
= 0 V; f = 1 MHz;
T
j
=2C; see Figure 14
- 4720 - pF
C
oss
output capacitance V
DS
=25V; V
GS
= 0 V; f = 1 MHz;
T
j
=2C; see Figure 13
- 456 - pF
C
rss
reverse transfer
capacitance
- 208 - pF
t
d(on)
turn-on delay time V
DS
=75V; R
L
=1.5; V
GS
=10V;
R
G(ext)
=5.6; T
j
=2C
-25-ns
t
r
rise time - 138 - ns
t
d(off)
turn-off delay time - 79 - ns
t
f
fall time - 93 - ns
Source-drain diode
V
SD
source-drain voltage I
S
=25A; V
GS
=0V; T
j
=2C;
see Figure 15
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs; V
GS
=0V;
V
DS
=30V; T
j
=2C
-118-ns
Q
r
recovered charge - 0.66 - nC

PSMN035-150B,118

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET TAPE13 PWR-MOS
Lifecycle:
New from this manufacturer.
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