R1LV0216BSB
R10DS0051EJ0100 Rev.1.00 Page 13 of
14
2011.03.30
Low Vcc Data Retention Characteristics
Parameter Symbol Min. Typ. Max. Unit Test conditions
*2
V
CC
for data retention V
DR
2.0 - 3.6 V
Vin 0V
(1) CS# Vcc-0.2V or
(2) LB# = UB# Vcc-0.2V,
CS# 0.2V
- 1
*1
2 μA ~+25°C
- - 3 μA ~+40°C
- - 8 μA ~+70°C
Data retention current I
CCDR
- - 10 μA ~+85°C
Vcc=3.0V, Vin 0V
(1) CS# Vcc-0.2V or
(2) LB# = UB# Vcc-0.2V,
CS# 0.2V
Chip deselect to data retention time t
CDR
0 - - ns
Operation recovery time t
R
5 - - ms
See retention waveform.
Note 1. Typical parameter indicates the value for the center of distribution at 3.0V (Ta= 25ºC), and not 100% tested.
2. CS# controls address buffer, WE# buffer, OE# buffer, LB# buffer, UB# buffer and Din buffer. If CS# controls
data retention mode, Vin levels (address, WE#, OE#, LB#, UB#, DQ) can be in the high impedance state.
R1LV0216BSB
R10DS0051EJ0100 Rev.1.00 Page 14 of
14
2011.03.30
Low Vcc Data Retention Timing Waveforms
CS#
Vcc
(1) CS# Controlled
t
CDR
t
R
2.7V 2.7V
2.2V 2.2V
V
DR
CS# Vcc - 0.2V
LB#, UB#
Vcc
(2) LB#, UB# Controlled
t
CDR
t
R
2.7V 2.7V
2.2V 2.2V
V
DR
LB#
UB# Vcc - 0.2V
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Revision History R1LV0216BSB Data Sheet
Description
Rev. Date
Page Summary
1.00 2011.03.30 - First Edition issued

R1LV0216BSB-5SI#B1

Mfr. #:
Manufacturer:
Renesas Electronics
Description:
SRAM SRAM 2MB ADV. 3V TSOP44 55NS -40TO85C
Lifecycle:
New from this manufacturer.
Delivery:
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