NDD60N550U1-35G

© Semiconductor Components Industries, LLC, 2013
December, 2013 Rev. 0
1 Publication Order Number:
NDD60N550U1/D
NDD60N550U1
N-Channel Power MOSFET
600 V, 550 mW
Features
100% Avalanche Tested
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant
ABSOLUTE MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol NDD Unit
DraintoSource Voltage V
DSS
600 V
GatetoSource Voltage V
GS
±25 V
Continuous Drain
Current R
q
JC
Steady
State
T
C
=
25°C
I
D
8.2
A
T
C
=
100°C
5.2
Power Dissipation –
R
q
JC
Steady
State
T
C
=
25°C
P
D
94 W
Pulsed Drain Current
t
p
= 10 ms
I
DM
34 A
Operating Junction and Storage
Temperature
T
J
,
T
STG
55 to
+150
°C
Source Current (Body Diode) I
S
8.2 A
Single Pulse DraintoSource Avalanche
Energy (I
D
= 4 A)
EAS 54 mJ
Peak Diode Recovery (Note 1) dv/dt 15 V/ns
Lead Temperature for Soldering Leads T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. I
SD
< 8.2 A, di/dt 400 A/ms, V
DS
peak
V
(BR)DSS
, V
DD
= 80% V
(BR)DSS
THERMAL RESISTANCE
Parameter Symbol Value Unit
JunctiontoCase (Drain) NDD60N550U1
R
q
JC
1.3 °C/W
JunctiontoAmbient Steady State
(Note 3) NDD60N550U1
(Note 2) NDD60N550U11
(Note 2) NDD60N550U135
R
q
JA
47
98
95
°C/W
2. Insertion mounted
3. Surface mounted on FR4 board using 1 sq. pad size
(Cu area = 1.127 in sq [2 oz] including traces)
http://onsemi.com
See detailed ordering and shipping information on page 3 of
this data sheet.
MARKING AND ORDERING INFORMATION
V
(BR)DSS
R
DS(ON)
MAX
600 V
550 mW @ 10 V
1
2
3
4
NChannel MOSFET
D (2)
S (3)
G (1)
IPAK
CASE 369D
STYLE 2
DPAK
CASE 369C
STYLE 2
1
2
3
4
IPAK
CASE 369AD
STYLE 2
1
2
3
4
NDD60N550U1
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Test Conditions Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
=0V, I
D
=1mA 600 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/T
J
540 mV/°C
DraintoSource Leakage Current I
DSS
V
DS
= 600 V, V
GS
=0V
T
J
=25°C 1 mA
T
J
= 125°C 100
GatetoSource Leakage Current I
GSS
V
GS
= ±25 V ±100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
DS
=V
GS
, I
D
= 250 mA
2 3.2 4 V
Negative Threshold Temperature Co-
efficient
V
GS(TH)
/T
J
Reference to 25°C, I
D
= 250 mA
7.6 mV/°C
Static Drain-to-Source On Resistance R
DS(on)
V
GS
=10V, I
D
=4A 510 550
mW
Forward Transconductance g
FS
V
DS
=15V, I
D
=4A 7.0 S
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
V
DS
=50V, V
GS
= 0 V, f = 1 MHz
540
pF
Output Capacitance C
oss
33
Reverse Transfer Capacitance C
rss
1.6
Effective output capacitance, energy
related (Note 6)
C
o(er)
V
GS
= 0 V, V
DS
= 0 to 480 V
24
Effective output capacitance, time
related (Note 7)
C
o(tr)
I
D
= constant, V
GS
= 0 V,
V
DS
= 0 to 480 V
84
Total Gate Charge Q
g
V
DS
= 300 V, I
D
= 9.5 A, V
GS
=10V
18
nC
Gate-to-Source Charge Q
gs
3.4
Gate-to-Drain Charge Q
gd
8.7
Plateau Voltage V
GP
5.4 V
Gate Resistance R
g
5.5
W
RESISTIVE SWITCHING CHARACTERISTICS (Note 5)
Turn-on Delay Time
t
d(on)
V
DD
= 300 V, I
D
= 9.5 A,
V
GS
=10V, R
G
= 0 W
8
ns
Rise Time t
r
14
Turn-off Delay Time t
d(off)
20
Fall Time t
f
17
SOURCEDRAIN DIODE CHARACTERISTICS
Diode Forward Voltage
V
SD
I
S
= 8.2 A, V
GS
=0V
T
J
=25°C 0.9 1.3
V
T
J
= 100°C 0.82
Reverse Recovery Time t
rr
V
GS
=0V, V
DD
=30V
I
S
= 9.5 A, d
i
/d
t
= 100 A/ms
290
ns
Charge Time t
a
160
Discharge Time t
b
130
Reverse Recovery Charge Q
rr
2.6
mC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Width 300 ms, Duty Cycle 2%.
5. Switching characteristics are independent of operating junction temperatures.
6. C
o(er)
is a fixed capacitance that gives the same stored energy as C
oss
while V
DS
is rising from 0 to 80% V
(BR)DSS
7. C
o(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 to 80% V
(BR)DSS
NDD60N550U1
http://onsemi.com
3
MARKING DIAGRAMS
IPAKIPAK DPAK
Y = Year
WW = Work Week
G = PbFree Package
1
Gate
2
Drain
3
Source
4
Drain
YWW
60N
550U1G
4
Drain
2
Drain
1
Gate
3
Source
YWW
60N
550U1G
4
Drain
1
Gate
2
Drain
3
Source
YWW
60N
550U1G
ORDERING INFORMATION
Device Package Shipping
NDD60N550U11G IPAK
(Pb-Free, Halogen-Free)
75 Units / Rail
NDD60N550U135G IPAK
(Pb-Free, Halogen-Free)
75 Units / Rail
NDD60N550U1T4G DPAK
(Pb-Free, Halogen-Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

NDD60N550U1-35G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IGBT Transistors MOSFET NFET DPAK 600V 8.2A 550MO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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