TPS2398, TPS2399
www.onsemi.com
10
APPLICATIONS INFORMATION
General
When a plug−in module or printed circuit card is inserted
into a live chassis slot, discharged supply bulk capacitance
on the board can draw huge transient currents from the
system supplies. Without some form of inrush limiting,
these currents can reach peak magnitudes ranging up to
several hundred amps, particularly in high−voltage systems.
Such large transients can damage connector pins, PCB etch,
and plug−in and supply components. In addition, current
spikes can cause voltage droops on the power distribution
bus, causing other boards in the system to reset.
The TPS2398 and TPS2399 are hot swap power managers
designed to limit these peaks to preset levels, as well as
control the slew rate (di/dt) at which charging current ramps
to the user−programmed limit. These devices use an external
N−channel pass FET and sense element to provide
closed−loop control of current sourced to the load. Input
supply under−voltage lockout (UVLO) protection allows
hot swap circuits to turn on automatically with the
application of power, or to be controlled with a system
command via the EN input. External capacitors control both
the current ramp rate, and the time−out period for load
voltage ramping. In addition, an internal overload
comparator provides circuit breaker protection against
shorts occurring during steady−state (post−turn−on)
operation of the card.
The TPS2398 and TPS2399 operate directly from the
input supply (nominal −48 VDC rail). The –VIN pin
connects to the negative voltage rail, and the RTN pin
connects to the supply return. Internal regulators convert
input power to the supply levels required by the device
circuitry. An input UVLO circuit holds the GATE output low
until the supply voltage reaches a nominal 30 V level. A
second comparator monitors the EN input; this pin must be
pulled above the 1.4 V enable threshold to turn on power to
the load.
Once enabled, and when the input supply is above the
UVLO threshold, the GATE pull−down is removed, the
linear control amplifier (LCA) is enabled, and a large
discharge device in the RAMP CONTROL block is turned
off. Subsequently, a small current source is now able to
charge an external capacitor connected to the IRAMP pin.
This results in a linear voltage ramp at IRAMP. The voltage
ramp on the capacitor actually has two discrete slopes. As
shown in Figure 2, charging current is supplied from either
of two sources. Initially at turn−on, the 600 nA source is
selected, to provide a slow turn−on rate. This slow turn−on
helps ensure that the LCA is pulled out of saturation, and is
slewing to the voltage at its non−inverting input before
normal rate load charging is allowed. This mechanism helps
reduce current steps at turn−on. Once the voltage at the
IRAMP pin reaches approximately 0.5 V, an internal
comparator de−asserts the SLOW signal, and the 10 mA
source is selected for the remainder of the ramp period.
The voltage at IRAMP is divided down by a factor of 100,
and applied to the non−inverting input of the LCA. Load
current magnitude information at the ISENS pin is applied
to the inverting input. This voltage is developed by
connecting the current sense resistor between ISENS and
−VIN. The LCA controls the gate of the external pass FET
to force the ISENS voltage to track the divided down
IRAMP voltage. Consequently, the load current slew rate
tracks the linear voltage ramp at the IRAMP pin, producing
a linear di/dt of the load current. The IRAMP capacitor is
charged to about 5 V; however, the LCA input is clamped at
40 mV. Therefore, the current sourced to the load during
turn−on is limited to a value given by I
MAX
≤ 40 mV / R
SNS
,
where R
SNS
is the value of the sense resistor.
The resultant load current, regulated by the controller,
charges the module’s input bulk capacitance in a safe
fashion. Under normal conditions, this capacitance
eventually charges up to the dc input potential. At this point,
the load demand drops off, and the voltage at ISENS
decreases. The LCA now drives the GATE output to its
supply rail.
The device detects this condition as the GATE voltage
rises through 7.5 V, latches this status and asserts the /PG
output. If the full sourced current limit is not yet available to
the load, as evidenced by the IRAMP voltage being less than
5 V, then the /PG assertion is delayed until that condition is
also met.
The peak, steady−state GATE pin output, typically 14 V,
ensures sufficient overdrive to fully enhance the external
FET, while not exceeding the typical 20 V V
GS
rating of
common N−channel power FETs.
Fault timing is accomplished by connecting a capacitor
between the FLTTIME and −VIN pins, allowing
user−programming of the timeout period. Whenever the hot
swap controller is in current control mode as described
above, the LCA asserts an overcurrent indication – OC
signal in the Figure 2. Overcurrent fault timing is inhibited
during the slow turn−on portion of the IRAMP waveform.
However, once the device transitions to the normal rate
current ramp (V
IRAMP
≥ 0.5 V), the external capacitor is
charged by a 50 mA source, generating a voltage ramp at the
FLTTIME pin. If the load voltage ramps successfully, the
fault capacitor is discharged, and load initialization can
begin. However, if the timing capacitor voltage attains the
4 V fault threshold, the LCA is disabled, the pass FET is
rapidly turned off, and the fault is latched. Fault capacitor
charging ceases, and the capacitor is then discharged. In
addition, latching of a fault condition causes rapid discharge
of the IRAMP capacitor. In this manner, the soft−start
function is then reset and ready for the next output enable,
if and when conditions permit.
Subsequent to a plug−in’s start−up, and during the
module’s steady−state operation, load faults that force
current limit operation also initiate fault timing cycles as