TLP3073,TLP3073F
13
16.
16.
16.
16. Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Item Name
TLP3073(F
TLP3073(LF1,F
TLP3073(LF5,F
TLP3073(TP1,F
TLP3073(TP5,F
TLP3073(D4,F
TLP3073(D4,LF1,F
TLP3073(D4,LF5,F
TLP3073(D4,TP1,F
TLP3073(D4,TP5,F
TLP3073F(F
TLP3073F(LF4,F
TLP3073F(TP4,F
TLP3073F(D4,F
TLP3073F(D4,LF4F
TLP3073F(D4,TP4F
Packaging (Note 1)
TH
LF1
LF5
LF1
LF5
TH
LF1
LF5
LF1
LF5
TH, Wide forming
LF4, Wide forming
LF4, Wide forming
TH, Wide forming
LF4, Wide forming
LF4, Wide forming
VDE Option
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
Packing (MOQ)
Magazine (50 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1500 pcs)
Tape and reel (1500 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1500 pcs)
Tape and reel (1500 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1000 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1000 pcs)
Note 1: TH: Through-hole, LF: Lead forming for surface mount
17.
17.
17.
17. Devices in Halogen-Free Resin Packages
Devices in Halogen-Free Resin Packages
Devices in Halogen-Free Resin Packages
Devices in Halogen-Free Resin Packages
This product is Halogen-Free
Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor
product" as a semiconductor product in which:
(1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony
(Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an
aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or
(2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine,
chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain
chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in
printed circuit boards.
For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make
any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following
elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At).
In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of
the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product
other than the encapsulating resins and the resin portion(s) in printed circuit boards.
The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and
belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and
belief on information provided by third parties, and Toshiba makes no representation or warranty as to the
accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide
accurate information to its customers, but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals.
2018-01-30
Rev.6.0
©2016-2018
Toshiba Electronic Devices & Storage Corporation
