2004 Nov 04 3
Philips Semiconductors Product specification
50 V, 3 A
NPN low V
CEsat
(BISS) transistor
PBSS4350X
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; standard footprint.
2. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 1 cm
2
.
3. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 6 cm
2
.
4. Device mounted on a ceramic printed-circuit board 7 cm
2
, single-sided copper, tin-plated.
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PBSS4350X SC-62 plastic surface mounted package; collector pad for good heat
transfer; 3 leads
SOT89
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter 50 V
V
CEO
collector-emitter voltage open base 50 V
V
EBO
emitter-base voltage open collector 5V
I
C
collector current (DC) note 4 3A
I
CM
peak collector current limited by T
j(max)
5A
I
B
base current (DC) 0.5 A
P
tot
total power dissipation T
amb
25 °C
note 1 550 mW
note 2 1W
note 3 1.4 W
note 4 1.6 W
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 150 °C
T
amb
ambient temperature 65 +150 °C
2004 Nov 04 4
Philips Semiconductors Product specification
50 V, 3 A
NPN low V
CEsat
(BISS) transistor
PBSS4350X
handbook, halfpage
0 40 80 160
P
tot
(W)
(1)
(2)
(3)
2
0
1.6
120
1.2
0.8
0.4
MLE186
T
amb
(°C)
(4)
Fig.2 Power derating curves.
(1) Ceramic PCB; 7 cm
2
mounting pad for collector.
(2) FR4 PCB; 6 cm
2
copper
mounting pad for collector.
(3) FR4 PCB; 1 cm
2
copper
mounting pad for collector.
(4) Standard footprint.
2004 Nov 04 5
Philips Semiconductors Product specification
50 V, 3 A
NPN low V
CEsat
(BISS) transistor
PBSS4350X
THERMAL CHARACTERISTICS
Notes
1. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; standard footprint.
2. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 1 cm
2
.
3. Device mounted on a FR4 printed-circuit board; single-sided copper; tin-plated; mounting pad for collector 6 cm
2
.
4. Device mounted on a ceramic printed-circuit board 7 cm
2
, single-sided copper, tin-plated.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air
note 1 225 K/W
note 2 125 K/W
note 3 90 K/W
note 4 80 K/W
R
th(j-s)
thermal resistance from junction to soldering point 16 K/W
006aaa243
10
1
10
2
10
3
Z
th
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
(1)
(6)
(7)
(8)
(9)
(10)
(5)
(2)
(3)
(4)
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
(1) δ =1.
(2) δ = 0.75.
(3) δ = 0.5.
(4) δ = 0.33.
(5) δ = 0.2.
(6) δ = 0.1.
(7) δ = 0.05.
(8) δ = 0.02.
(9) δ = 0.01.
(10) δ =0.
Mounted on FR4 printed-circuit board; standard footprint.

M40-3010446

Mfr. #:
Manufacturer:
Harwin
Description:
Headers & Wire Housings 4P SIL SMT VERTICAL SHROUDED TAB HEADER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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