SSM2517 Data Sheet
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 4.
Parameter Rating
PVDD Supply Voltage −0.3 V to +6 V
VDD Supply Voltage −0.3 V to +3.6 V
Input Voltage (Signal Source) −0.3 V to +3.6 V
ESD Susceptibility 4 kV
OUT− and OUT+ Pins 8 kV
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature Range −65°C to +165°C
Lead Temperature (Soldering, 60 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θ
JA
) is specified for the worst-
case conditions, that is, a device soldered in a printed circuit board
(PCB) for surface-mount packages. θ
JA
and θ
JB
(junction-to-board
thermal resistance) are determined according to JEDEC JESD51-9
on a 4-layer PCB with natural convection cooling.
Table 5. Thermal Resistance
Package Type PCB θ
JA
θ
JB
Unit
9-Ball, 1.5 mm × 1.5 mm WLCSP 1S0P 162 39 °C/W
2S0P 76 21 °C/W
ESD CAUTION
