28
LTC1923
1923f
LINEAR TECHNOLOGY CORPORATION 2001
LT/TP 0502 2K • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LTC1658 14-Bit Rail-to-Rail Micropower DAC 3V or 5V Single Supply Operation, I
CC
= 270µA,
8-Lead MSOP Package
LTC1693-1 High Speed Dual N-Channel MOSFET Driver 1.5A Peak Output Current, 1GΩ Electrical Isolation, SO-8 Package
LTC2053 Zero Drift Instrumentation Amp Max Gain Error 0.01%, Input Offset Drift of 50nV/°C, Input Offset Voltage of 10µV
U
PACKAGE DESCRIPTIO
5.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO INCLUDE JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
PIN 1
TOP MARK
0.40 ± 0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.23 ± 0.05
(UH) QFN 0102
0.50 BSC
0.200 REF
0.00 – 0.05
0.57 ±0.05
3.45 ±0.05
(4 SIDES)
4.20 ±0.05
5.35 ±0.05
0.23 ± 0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
