NVMFD5C674NLWFT1G

© Semiconductor Components Industries, LLC, 2015
August, 2017 Rev. P3
1 Publication Order Number:
NVMFD5C674NL/D
NVMFD5C674NL
Power MOSFET
60 V, 14.4 mW, 42 A, Dual NChannel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NVMFD5C674NLWF Wettable Flank Option for Enhanced Optical
Inspection
AECQ101 Qualified and PPAP Capable
These Devices are PbFree and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DraintoSource Voltage V
DSS
60 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 2, 3)
Steady
State
T
C
= 25°C
I
D
42
A
T
C
= 100°C 26
Power Dissipation
R
q
JC
(Notes 1, 2)
T
C
= 25°C
P
D
37
W
T
C
= 100°C 18
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
11
A
T
A
= 100°C 7.5
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.0
W
T
A
= 100°C 1.5
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
119 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+ 175
°C
Source Current (Body Diode) I
S
44 A
Single Pulse DraintoSource Avalanche
Energy (T
J
= 25°C, I
L(pk)
= 1.6 A)
E
AS
61 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase Steady State
R
q
JC
2.86
°C/W
JunctiontoAmbient Steady State (Note 2)
R
q
JA
49
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surfacemounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
60 V
14.4 mW @ 10 V
42 A
20.4 mW @ 4.5 V
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
ORDERING INFORMATION
D1
D1
D2
D2
S1
G1
S2
G2
Dual NChannel
D1
S1
G1
XXXXXX
AYWZZ
D2
D1
D2
S2
G2
D2
D1
DFN8 5x6
(SO8FL)
CASE 506BT
1
NVMFD5C674NL
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
60 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
28
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 60 V
T
J
= 25 °C 10
mA
T
J
= 125°C 100
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 25 mA
1.2 2.2 V
Negative Threshold Temperature Coefficient V
GS(TH)
/T
J
4.6 mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V I
D
= 10 A 11.7 14.4
mW
V
GS
= 4.5 V I
D
= 10 A 16.4 20.4
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 10 A 27.5 S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
640
pF
Output Capacitance C
OSS
313
Reverse Transfer Capacitance C
RSS
7.7
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 48 V; I
D
= 20 A 4.7
nC
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 48 V; I
D
= 20 A 10
Threshold Gate Charge Q
G(TH)
V
GS
= 4.5 V, V
DS
= 48 V; I
D
= 10 A
1.4
GatetoSource Charge Q
GS
2.3
GatetoDrain Charge Q
GD
1.0
Plateau Voltage V
GP
3.1 V
SWITCHING CHARACTERISTICS (Note 5)
TurnOn Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 48 V,
I
D
= 5 A, R
G
= 1.0 W
9.5
ns
Rise Time t
r
32.1
TurnOff Delay Time t
d(OFF)
18.6
Fall Time t
f
27.5
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 10 A
T
J
= 25°C 0.9 1.2
V
T
J
= 125°C 0.8
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 20 A/ms,
I
S
= 5 A
23.8
ns
Charge Time t
a
11.5
Discharge Time t
b
12.3
Reverse Recovery Charge Q
RR
11.2 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
NVMFD5C674NL
www.onsemi.com
3
TYPICAL CHARACTERISTICS
0.01
0.1
1
10
100
1000
10000
100000
5 10152025303540
10
12
14
16
18
20
22
24
26
10 12 14 16 18 20 22 24 26 28 30
10
15
20
25
30
35
40
345678910
0
5
10
15
20
25
30
35
40
0.0 0.5 1.0 1.5 2.0 2.5
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE VOLTAGE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
Figure 3. OnResistance vs. GatetoSource
Voltage
Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATETOSOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAINTO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (nA)
2.6 V
3.0 V
T
J
= 125°C
T
J
= 25°C
T
J
= 55°C
T
J
= 25°C
I
D
= 10 A
T
J
= 25°C
V
GS
= 10 V
V
GS
= 10 V
I
D
= 10 A
T
J
= 125°C
T
J
= 85°C
3.4 V
V
DS
= 10 V
T
J
= 150°C
V
GS
= 4.5 V to 10 V
2.8 V
3.2 V
3.6 V
T
J
= 25°C
V
GS
= 4.5 V
0
5
10
15
20
25
30
0123456
0
0.5
1
1.5
2
2.5
50 25 0 25 50 75 100 125 150 175
T
J
= 175°C

NVMFD5C674NLWFT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET T6 60V LL S08FL DS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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