IXXH50N60C3D1

© 2013 IXYS CORPORATION, All Rights Reserved
XPT
TM
600V IGBT
GenX3
TM
w/ Diode
IXXH50N60C3D1
V
CES
= 600V
I
C110
= 50A
V
CE(sat)
2.30V
t
fi(typ)
= 42ns
Symbol Test Conditions Maximum Ratings
V
CES
T
J
= 25°C to 175°C 600 V
V
CGR
T
J
= 25°C to 175°C, R
GE
= 1MΩ 600 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
T
C
= 25°C (Chip Capability) 100 A
I
C110
T
C
= 110°C 50 A
I
F110
T
C
= 110°C 30 A
I
CM
T
C
= 25°C, 1ms 200 A
I
A
T
C
= 25°C 25 A
E
AS
T
C
= 25°C 200 mJ
SSOA V
GE
= 15V, T
VJ
= 150°C, R
G
= 5Ω I
CM
= 100 A
(RBSOA) Clamped Inductive Load @ V
CES
t
sc
V
GE
= 15V, V
CE
= 360V, T
J
= 150°C 10 μs
(SCSOA) R
G
= 22Ω, Non Repetitive
P
C
T
C
= 25°C 600 W
T
J
-55 ... +175 °C
T
JM
175 °C
T
stg
-55 ... +175 °C
T
L
Maximum Lead Temperature for Soldering 300 °C
T
SOLD
1.6 mm (0.062in.) from Case for 10s 260 °C
M
d
Mounting Torque 1.13/10 Nm/lb.in.
Weight 6g
DS100274A(01/13)
G = Gate C = Collector
E = Emitter Tab = Collector
TO-247 AD
G
C
E
Tab
Extreme Light Punch Through
IGBT for 20-60 kHz Switching
Features
z
Optimized for 20-60kHz Switching
z
Square RBSOA
z
Anti-Parallel Ultra Fast Diode
z
Avalanche Capability
z
Short Circuit Capability
z
International Standard Package
Advantages
z
High Power Density
z
175°C Rated
z
Extremely Rugged
z
Low Gate Drive Requirement
Applications
z
Power Inverters
z
UPS
z
Motor Drives
z
SMPS
z
PFC Circuits
z
Battery Chargers
z
Welding Machines
z
Lamp Ballasts
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
BV
CES
I
C
= 250μA, V
GE
= 0V 600 V
V
GE(th)
I
C
= 250μA, V
CE
= V
GE
3.0 5.5 V
I
CES
V
CE
= V
CES
,
V
GE
= 0V 25 μA
T
J
= 150°C 3 mA
I
GES
V
CE
= 0V, V
GE
= ±20V ±100 nA
V
CE(sat)
I
C
= 36A, V
GE
= 15V, Note 1 1.95 2.30 V
T
J
= 150°C 2.45 V
Preliminary Technical Information
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXXH50N60C3D1
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
g
fs
I
C
= 36A, V
CE
= 10V, Note 1 11 18 S
C
ie
s
2320 pF
C
oes
V
CE
= 25V, V
GE
= 0V, f = 1MHz 138 pF
C
res
42 pF
Q
g
64 nC
Q
ge
I
C
= 36A, V
GE
= 15V, V
CE
= 0.5 V
CES
18 nC
Q
gc
25 nC
t
d(on)
24 ns
t
ri
40 ns
E
on
0.72 mJ
t
d(off)
62 100 ns
t
fi
42 ns
E
of
f
0.33 0.55 mJ
t
d(on)
25 ns
t
ri
44 ns
E
on
1.46 mJ
t
d(off)
80 ns
t
fi
90 ns
E
off
0.48 mJ
R
thJC
0.25 °C/W
R
thCS
0.21 °C/W
Inductive load, T
J
= 25°C
I
C
= 36A, V
GE
= 15V
V
CE
= 360V, R
G
= 5Ω
Note 2
Notes:
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Switching times & energy losses may increase for higher V
CE
(clamp), T
J
or R
G
.
e
P
TO-247 (IXXH) Outline
1 2 3
Terminals: 1 - Gate 2 - Collector
3 - Emitted
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.7 5.3 .185 .209
A
1
2.2 2.54 .087 .102
A
2
2.2 2.6 .059 .098
b 1.0 1.4 .040 .055
b
1
1.65 2.13 .065 .084
b
2
2.87 3.12 .113 .123
C .4 .8 .016 .031
D 20.80 21.46 .819 .845
E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225
L 19.81 20.32 .780 .800
L1 4.50 .177
P 3.55 3.65 .140 .144
Q 5.89 6.40 0.232 0.252
R 4.32 5.49 .170 .216
S 6.15 BSC 242 BSC
Inductive load, T
J
= 150°C
I
C
= 36A, V
GE
= 15V
V
CE
= 360V, R
G
= 5Ω
Note 2
Reverse Diode (FRED)
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
V
F
I
F
= 30A, V
GE
= 0V, Note 1 2.7 V
T
J
= 150°C 1.6 V
I
RM
T
J
= 100°C 4 A
t
rr
T
J
= 100°C 100 ns
25 ns
R
thJC
0.9 °C/W
I
F
= 30A, V
GE
= 0V, -di
F
/dt = 100A/μs,
V
R
= 100V
I
F
= 1A, V
GE
= 0V, -di
F
/dt = 100A/μs, V
R
= 30V
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
© 2013 IXYS CORPORATION, All Rights Reserved
IXXH50N60C3D1
Fig. 1. Output Characteristics @ T
J
= 25ºC
0
5
10
15
20
25
30
35
40
45
50
55
00.511.522.53
V
CE
- Volts
I
C
- Amperes
V
GE
= 15
V
14
V
13
V
10V
8V
6V
12V
9V
11V
Fig. 2. Extended Output Characteristics @ T
J
= 25ºC
0
20
40
60
80
100
120
140
160
0 5 10 15 20 25 30
V
CE
- Volts
I
C
-
Amperes
V
GE
= 15V
7V
9V
11V
13V
12V
14V
10V
Fig. 3. Output Characteristics @ T
J
= 150ºC
0
5
10
15
20
25
30
35
40
45
50
55
00.511.522.533.54
V
CE
- Volts
I
C
- Amperes
V
GE
= 15
V
14
V
13
V
10V
12V
9V
6V
11V
8V
Fig. 4. Dependence of V
CE(sat)
on
Junction Temperature
0.6
0.8
1.0
1.2
1.4
1.6
1.8
-50 -25 0 25 50 75 100 125 150 175
T
J
- Degrees Centigrade
V
CE(sat)
- Normalized
V
GE
= 15V
I
C
= 36A
I
C
= 18A
I
C
= 54A
Fig. 5. Collector-to-Emitter Voltage vs.
Gate-to-Emitter Voltage
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
8 9 10 11 12 13 14 15
V
GE
- Volts
V
CE
- Volts
I
C
= 54
A
T
J
= 25ºC
36
A
18
A
Fig. 6. Input Admittance
0
10
20
30
40
50
60
70
80
90
100
45678910111213
V
GE
- Volts
I
C
-
Amperes
T
J
= 15C
25ºC
- 40ºC

IXXH50N60C3D1

Mfr. #:
Manufacturer:
Description:
IGBT Transistors XPT IGBT C3-Class 600V/100Amp CoPacked
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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