ACAS 0606 AT, ACAS 0612 AT - Precision
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Vishay Beyschlag
Revision: 12-Apr-13
5
Document Number: 28770
For technical questions, contact: thinfilmarray@vishay.com
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DESCRIPTION
The production of the components is strictly controlled and
follows an extensive set of instructions established for
reproducibility. A homogeneous film of metal alloy is
deposited on a high grade (Al
2
O
3
) ceramic substrate using a
mask to separate the adjacent resistors and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are realized on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics.
The resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3
(3)
.
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using reflow or vapour phase as shown in
IEC 61760-1
(3)
. The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes. The
permitted storage time is 20 years, whereas the solderability
is specified for 2 years after production or requalification.
The immunity of the plating against tin whisker growth has
been proven under extensive testing.
All products comply with the GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EC Restriction of the use of Hazardous
Substances directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
The chip resistor array is AEC-Q200 qualified.
Where applicable, the resistors are tested in accordance
with EN 140401-801 which refers to EN 60115-1 and
EN 140400.
Notes
(1)
Global Automotive Declarable Substance List, see www.gadsl.org.
(2)
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org
policy
environmental policy group chemicals jig Joint Industry Guide (JIG-101 Ed 2.0).
(3)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
FUNCTIONAL PERFORMANCE
100- 55
Ambient Temperature in °C
155
0
Rated Power in %
050
70
Power Mode
Standard Mode
20
40
60
80
100
125
180
For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above
Derating
