MC100LVEL11
www.onsemi.com
4
Table 6. AC CHARACTERISTICS V
CC
= 3.3 V; V
EE
= 0.0 V or V
CC
= 0.0 V; V
EE
= −3.3 V (Note 9)
−40°C 25°C 95°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
f
max
Maximum Toggle Frequency 1.0 GHz
t
PLH
t
PHL
Propagation Delay to Output 235 385 255 330 405 285 435 ps
t
SKEW
Within-Device Skew (Note 10)
Device−to−Device (Note 11)
Duty Cycle Skew (Note 12)
5
10
20
150
20
5
10
20
150
20
5
10
20
150
20
ps
t
JITTER
Random Clock Jitter (RMS) 0.6 ps
V
PP
Input Swing (Note 13) 200 1000 200 1000 200 1000 mV
t
r
t
f
Output Rise/Fall Times Q
(20% − 80%)
120 320 120 220 320 120 320 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
9. V
EE
can vary ±0.3 V.
10.Within-device skew defined as identical transitions on similar paths through a device.
11. Device−to−device skew for identical transitions at identical V
CC
levels.
12.Duty cycle skew is the difference between a t
PLH
and t
PHL
propagation delay through a device.
13.V
PP
(min) is the minimum input swing for which AC parameters guaranteed. The device will function properly with input swings below 200 mV,
however, AC delays may move outside of the specified range. The device has a DC gain of ≈40.
Figure 2. Output Swing versus Frequency
0
200
400
600
800
0 200 400 600 800 1000 1200 1400 1600 1800 2000
f (MHz)
V
OUT(PP)
(mV)
