Characteristics STPS2L60
4/9 Doc ID 9173 Rev 6
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
I (A)
M
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ=0.5
t(s)
T =25°C
a
T =125°C
a
T =75°C
a
0
5
10
15
20
25
30
1.E-03 1.E-02 1.E-01 1.E+00
T
L
=25°C
T
L
=75°C
T
L
=125°C
SMBflat
I (A)
M
t(s)
IM
t
δ=0.5
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
t (s)
p
Single pulse
epoxy pri nted cir cui t board FR4, copper thickness: 35 µm
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Single pulse
Figure 11. Relative variation of thermal
impedance junction to lead versus
pulse duration (SMB flat)
Figure 12. Reverse leakage current versus
reverse voltage applied
(typical values)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
Z/R
th(j-l) th(j-l)
t (s)
p
epoxy printed circuit board FR4, copper thickness: 35 µm
I (µA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
0 102030405060
V (V)
R
T =125°C
j
T =150°C
j
T =100°C
j
T =75°C
j
T =50°C
j
T =25°C
j
