MAX2369
Complete Dual-Band
Quadrature Transmitter
______________________________________________________________________________________ 13
BIT NAME FUNCTION
IF_PLL_SHDN 1 0 shuts down the IF PLL. This mode is used with an external IF VCO and IF PLL.
UNUSED 1 Set to 0 for normal operation.
UNUSED 0 Set to 0 for normal operation.
ICP 00
A 2-bit register sets the IF charge-pump current as follows:
00 = 200µA
01 = 260µA
10 = 400µA
11 = 530µA
VCO_BYPASS 0 1 bypasses IF VCO and enables a buffered input for external VCO use.
BUF_DIV 0 1 selects ÷2 on IFLO port; 0 bypasses the divider.
IQ_LEVEL 1 1 selects 200mV
RMS
input mode; 0 selects 100mV
RMS
input mode.
UNUSED 00 Not used. Leave in the power-up/initialized state.
15
14
13
9, 8
10
11
12
7, 6
IF_PD_POL 1 5
IF phase-detector polarity; 1 selects positive polarity (increasing tuning voltage
on the VCO produces increasing frequency); 0 selects negative polarity
(increasing tuning voltage on the VCO produces decreasing frequency).
UNUSED 111 4, 3 ,2 Not used. Leave in the power-up/initialized state.
LD_MODE 1 0
Determines output mode for LOCK detector pin as follows:
0 = test mode, LD_MODE cannot be 0 for normal operation
1 = IF PLL lock detector
POWER-UP
STATE
BIT
LOCATION
(0 = LSB)
Table 4. Configuration Register (CONFIG)
Electromagnetic
Compliance Considerations
Two major concepts should be employed to produce a
noise-free and EMC-compliant transmitter: minimize cir-
cular current-loop area to reduce H-field radiation and
minimize voltage drops to reduce E-field radiation. To
minimize the circular current-loop area, bypass as
close to the part as possible and use the distributed
capacitance of a ground plane. To minimize voltage
drops, make V
CC
traces short and wide, and make RF
traces short.
The don't care bits in the registers should be zero in
order to minimize electromagnetic radiation due to
unnecessary bit banging. RC filtering can also be used
to slow the clock edges on the 3-wire interface, reduc-
ing high-frequency spectral content. RC filtering also
provides for transient protection against IEC802 testing
by shunting high frequencies to ground, while the
series resistance attenuates the transients for error-free
operation. The same applies to the override pins
(SHDN, TXGATE).
When floating the override pins, bypass to ground with
the capacitors as close to the part as possible.
High-frequency bypass capacitors are required close
to the pins with a dedicated via to ground. The 48-pin
QFN-EP package provides minimal inductance ground
by using an exposed paddle under the part. Provide at
least five low-inductance vias under the paddle to
ground to minimize ground inductance. Use a solid
ground plane wherever possible. Any cutout in the
ground plane may act as slot radiator and reduce its
shield effectiveness.
Keep the RF LO traces as short as possible to reduce
LO radiation and susceptibility to interference.
UNUSED 1 1 Set to 0 for normal operation.
MAX2369
Complete Dual-Band
Quadrature Transmitter
14 ______________________________________________________________________________________
Table 5. Power-Down Modes
Table 6. Register and Control Pin States for Key Operating Modes
X = Don’t care
OFF
POWER-DOWN MODES COMMENTS
UPCONVERTER
MODULATOR
SERIAL BUS
OPCTRL REG
IF LO BUFFER
IF VCO
IF PLL
IF PLL REGS
CONFIG REG
SHDN pin Ultra-low shutdown current XXXXXXXXX
TXGATE pin For punctured TX mode X X
IF PLL SHDN For external IF PLL use X X
TX STBY TX is off, but IF LO stays locked X X
REG STBY Shuts down, but preserves registers X X X X X
REG SHDN Serial bus is still active X X XXXXXX
OPCTRL REGISTER
C O N T R O L
PINS
MODE DESCRIPTION
LO_SEL
MODE
MOD_TYPE
STBY
TXSTBY
SHDN_BIT
IF_PLL_SHDN
TXGATE
SHDN
PCS Digital RFH selected 0 11 1 1 1 1 1 H H
Cellular Digital RFL selected 1 01 1 1 1 1 1 H H
FM Direct VCO modulation, RFL selected 1 00 0 1 1 1 1 H H
FM_IQ FM with IQ modulation, RFL selected 1 00 1 1 1 1 1 H H
PCS TXGATE Gated transmission, PCS 0 11 1 1 X 1 1 L H
Cellular TXGATE Gated transmission, cellular digital 1 01 1 1 X 1 1 L H
Sleep Everything off X XX X X X X X X L
MAX2369
Complete Dual-Band
Quadrature Transmitter
______________________________________________________________________________________ 15
t
CS
t
CH
t
CWL
t
CWH
DI
NOTE: THE 3-WIRE BUS IS SPI/QSPI/MICROWIRE-COMPATIBLE.
CLK
CS
t
ES
B19 (MSB) B18 B0 A3 A1 A0 (LSB)
t
CS
> 50ns
t
CH
> 10ns
t
CWH
> 50ns
t
ES
> 50ns
t
CWL
> 50ns
t
EW
> 50ns
t
EW
Figure 3. 3-Wire Interface Diagram
IF Tank Design
The IF VCO tank (TANK+, TANK-) is fully differential.
The external tank components are shown in Figure 4.
The frequency of oscillation is determined by the follow-
ing equation:
C
INT
= Internal capacitance of TANK port
C
D
= Capacitance of varactor
C
VAR
= Equivalent variable tuning capacitance
C
PAR
= Parasitic capacitance due to PC board pads
and traces
C
CENT
= External capacitor for centering oscillation fre-
quency
C
C
= External coupling capacitor to the varactor
Internal to the IC, the charge pump will have a leakage
of less than 10nA. This is equivalent to a 300M shunt
resistor. The charge-pump output must see an
extremely high DC resistance of greater than 300M.
This will minimize charge-pump spurs at the compari-
son frequency. Make sure there is no solder flux under
the varactor or loop filter.
Layout Issues
The MAX2369 EV kit can be used as a starting point for
layout. For best performance, take into consideration
power-supply issues, as well as the RF, LO, and IF lay-
out.
Power-Supply Layout
To minimize coupling between different sections of the
IC, the ideal power-supply layout is a star configuration,
which has a large decoupling capacitor at a central
V
CC
node. The V
CC
traces branch out from this node,
each going to a separate V
CC
node in the MAX2369
circuit. At the end of each trace is a bypass capacitor
with impedance to ground less than 1 at the frequen-
cy of interest. This arrangement provides local decou-
pling at each V
CC
pin. Use at least one via per bypass
capacitor for a low-inductance ground connection.
Matching Network Layout
The layout of a matching network can be very sensitive
to parasitic circuit elements. To minimize parasitic
inductance, keep all traces short and place compo-
nents as close to the IC as possible. To minimize para-
sitic capacitance, a cutout in the ground plane (and
any other planes) below the matching network compo-
nents can be used.
On the high-impedance ports (e.g., IF inputs and out-
puts), keep traces short to minimize shunt capacitance.
f
2(C C C C)L
C
CC
2(C + C )
OSC
INT CENT VAR PAR
VAR
DC
DC
=
+++
=
×
1
π
L
C
D
C
CENT
C
PAR
C
C
C
C
C
D
MAX2369
C
INT
-R
n
Figure 4. Tank Port Oscillator

MAX2369EGM+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
RF Transmitter Complete Dual-Band Quadrature Txr
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