4
Solder Reow Temperature Prole
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended Pb-Free IR Prole
Regulatory Information
The HCPL-J314 has been approved
by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
UL
Approval under UL 1577, compo-
nent recognition program up to
V
ISO
= 3750 Vrms. File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Note: Non-halide ux should be used.
Note: Non-halide ux should be used.
5
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
T
S
– CASE TEMPERATURE – °C
200
600
400
25
HCPL-J314
800
50 75 100
200
150 175
P
S
(mW)
125
100
300
500
700
I
S
(mA)
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics
Description Symbol Characteristic Unit
Installation classication per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V
rms
I - IV
for rated mains voltage ≤ 300 V
rms
I - IV
for rated mains voltage ≤ 600 V
rms
I - III
Climatic Classication 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage V
IORM
891 V
peak
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test with t
m
= 1 sec, V
PR
1670 V
peak
Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and Sample Test, t
m
= 60 sec, V
PR
1336 V
peak
Partial discharge < 5 pC
Highest Allowable Overvoltage (Transient Overvoltage t
ini
= 10 sec) V
IOTM
6000 V
peak
Safety-limiting values – maximum values allowed in the event of a failure.
Case Temperature T
S
175 °C
Input Current** I
S,INPUT
400 mA
Output Power** P
S, OUTPUT
1200 mW
Insulation Resistance at T
S
, V
IO
= 500 V R
S
>10
9
Ω
*Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, IEC/
EN/DIN EN 60747-5-2 for a detailed description of Method a and Method b partial discharge test proles.
** Refer to the following gure for dependence of P
S
and I
S
on ambient temperature.
6
Insulation and Safety Related Specications
Parameter Symbol HCPL-J314 Units Conditions
Minimum External Air Gap L(101) 7.4 mm Measured from input terminals to output
(Clearance) terminals, shortest distance through air.
Minimum External Tracking L(102) 8.0 mm Measured from input terminals to output
(Creepage) terminals, shortest distance path along body.
Minimum Internal Plastic Gap 0.5 mm Through insulation distance conductor to
(Internal Clearance) conductor, usually the straight line distance
thickness between the emitter and detector.
Tracking Resistance CTI >175 V DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Note
Storage Temperature T
S
-55 125 °C
Operating Temperature T
A
-40 100 °C
Average Input Current I
F(AVG)
25 mA 1
Peak Transient Input Current I
F(TRAN)
1.0 A
(<1 µs pulse width, 300pps)
Reverse Input Voltage V
R
5 V
“High” Peak Output Current I
OH(PEAK)
0.6 A 2
“Low” Peak Output Current I
OL(PEAK)
0.6 A 2
Supply Voltage V
CC
- V
EE
-0.5 35 V
Output Voltage V
O(PEAK)
-0.5 V
CC
V
Output Power Dissipation P
O
260 mW 3
Input Power Dissipation P
I
105 mW 4
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reow Temperature Prole See Package Outline Drawings section

HCPL-J314

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
High Speed Optocouplers 0.4A IGBT Gate Drive
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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