MC100LVEL16
www.onsemi.com
9
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C0.10
C0.10
C0.08
NOTE 4
A1
SEATING
PLANE
e/2
e
8X
K
NOTE 3
b
8X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 2.00 BSC
D2 1.10 1.30
E 2.00 BSC
E2 0.70 0.90
e 0.50 BSC
K
L 0.25 0.35
1
4
8
5
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
0.50
8X
DIMENSIONS: MILLIMETERS
0.30
PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
L1 −−− 0.10
0.30 REF
0.90
1.30
UBLICATION ORDERING INFORMATION
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MC100LVEL16/D
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