MC100LVEL37
www.onsemi.com
4
Table 6. AC CHARACTERISTICS (V
CC
= 3.3 V; V
EE
= 0.0 V or V
CC
= 0.0 V; V
EE
= −3.3 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
fmax Maximum Toggle Frequency TBD TBD TBD GHz
t
PLH
t
PHL
Propagation Delay
CLK to Q/Q
(Diff)
CLK to Q/Q
MR to Q
640
620
640
940
920
920
680
680
680
700
700
700
920
940
920
720
720
720
980
970
980
ps
t
SKEW
Within-Device Skew (Note 2)
Duty Cycle Skew (Differential Configuration)
(Note 3)
50
50
50
50
50
50
ps
t
JITTER
Cycle-to-Cycle Jitter TBD TBD TBD ps
V
PP
Input Swing (Note 4) 150 1000 150 1000 150 1000 mV
t
r
t
f
Output Rise/Fall Times Q (20%−80%) 280 550 280 550 280 550 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. V
EE
can vary ±0.3 V.
2. Within-device skew defined as identical transitions on similar paths through a device.
3. Duty cycle skew is the difference between a TPLH and TPHL propagation delay through a device.
4. V
PP
(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈40.
