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TSL1401CL

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27
ams Datasheet Page 19
[v1-01] 2016-Aug-30 Document Feedback
TSL1401CL − Package Information
Figure 20:
Package CL Carrier Tape
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing A
o
, B
o
, and K
o
are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
TOP VIEW
DETAIL B
DETAIL A
3.45
A
o
9.85
B
o
1.53
K
o
0.30
0.02
8 Max
8.00
2.00
4.00
1.50
+ 0.10
− 0.00
1.50
+ 0.25
− 0.00
16.00
+ 0.30
− 0.10
1.75
7.50
AA
B
B
7 Max
Page 20 ams Datasheet
Document Feedback [v1-01] 2016-Aug-30
TSL1401CL − Soldering Information
The CL package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 21:
Solder Reflow Profile
Figure 22:
Solder Reflow Profile Graph
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time t
soak
2 to 3 minutes
Time above 217°C (T
1
)t
1
Max 60 s
Time above 230°C (T
2
)t
2
Max 50 s
Time above T
peak
- 10°C (T
3
)t
3
Max 10 s
Peak temperature in reflow T
peak
260°C
Temperature gradient in cooling Max -5°C/s
Soldering Information
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (s)
Temperature (C)
ams Datasheet Page 21
[v1-01] 2016-Aug-30 Document Feedback
TSL1401CL − Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The CL package has been assigned a moisture sensitivity level
of MSL 5a and the devices should be stored under the following
conditions:
• Temperature Range: 5°C to 50°C
• Relative Humidity: 60% maximum
• Total Time: 6 months from the date code on the
aluminized envelope - if unopened
• Opened Time: 24 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 6 months or if the aluminized envelope
has been open for more than 24 hours. If rebaking is required,
it should be done at 60°C for 24 hours.
Storage Information
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27

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