OP200 Data Sheet
Rev. G | Page 16 of 16
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AA
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0.75 (0.0295)
0.25 (0.0098)
45°
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
16
9
8
1
1.27 (0.0500)
BSC
03-27-2007-B
Figure 38. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
S-Suffix
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
T
A
= 25°C V
OS
Max (µV) Temperature Range Package Description Package Option
OP200AZ 75 −55°C to +125°C 8-Lead CERDIP Z-Suffix (Q-8)
OP200EZ 75 −40°C to +85°C 8-Lead CERDIP Z-Suffix (Q-8)
OP200GPZ 200 −40°C to +85°C 8-Lead PDIP P-Suffix (N-8)
OP200GSZ 200 −40°C to +85°C 16-Lead SOIC_W S-Suffix (RW-16)
OP200GSZ-REEL 200 −40°C to +85°C 16-Lead SOIC_W S-Suffix (RW-16)
1
The OP200GPZ, OP200GSZ, and OP200GSZ-REEL are RoHS Compliant Parts.
©1978–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00322-0-3/17(G)
