Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5 °C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm)
coated
uncoated (lead spacing > 10 mm)
260 ±5 °C 10 ±1 s
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
5 ±1 s
MKP
MKT
(lead spacing ≤ 7.5 mm)
uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
< 4 s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
B32671Z ... B32673Z
Power Factor Correction
Page 12 of 20Please read Cautions and warnings and
Important notes at the end of this document.
