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Ringing to Talk Logic Sequence: Break-Before-Make
Logic states and explanations are provided in the Introduction” on page 9.
2.8 Ringing Switch Zero-Cross Current Turn Off
After the application of a logic change to cease
ringing, the ringing switch (SW4), designed to delay
deactivation until a zero current event, will remain
active until a current zero-crossing occurs. Once on
(active) the ringing switch requires a zero current
event to turn off and therefore should not be used to
switch a DC-only signal. This zero current switching
characteristic will reduce and possibly eliminate
overall system impulse noise normally associated with
ringing switches. See IXYS Integrated Circuits
Division application note AN-144, Impulse Noise Benefits
of Line Card Access Switches for more information. The
attributes of ringing switch SW4 may make it possible
to eliminate the need for a zero-cross switching
scheme. A minimum impedance of 300 in series with
the ringing generator is recommended.
2.9 Power Supplies
Both a +5V supply and battery voltage are connected
to the CPC7691. Switch state control is powered
exclusively by the +5V supply. As a result, the
CPC7691 exhibits extremely low power consumption
during active and idle states.
2.10 Internal Protection
The CPC7691 uses a combination of current limited
break switches, a diode bridge/SCR clamping circuit,
and a thermal shutdown mechanism to protect the
SLIC device or other associated circuitry from damage
during line transient events such as lightning and fault
conditions such as power induction and power-cross.
2.10.1 Current Limiting Function
If a lightning strike transient occurs when the device is
in the talk state, the current passed from the line to the
internal integrated protection circuitry is restricted by
the dynamic current limit response of the active break
switches. For instance, during the talk state when a
1000V 10x1000 s lightning pulse (GR-1089-CORE)
is applied to the line though a properly clamped
external protector, the current seen at T
LINE
or R
LINE
will be a pulse having a typical magnitude of 2.5A with
a duration less than 0.5 s.
Whenever a power-cross fault occurs with the device
in the talk state, the current passed though the break
switches SW1 and SW2 on to the integrated
protection circuit is limited by the DC current limit
response of the break switches. The DC current limit
specified over temperature ranges from 80mA to
425mA and has a negative temperature coefficient. As
a result, if the device is subjected to extended heating
due to a power-cross fault condition, the measured
current into T
LINE
or R
LINE
will decrease as the device
temperature increases. If the device temperature rises
sufficiently, the thermal shutdown mechanism will
activate, and the device will enter the All-Off state.
2.10.2 Diode Bridge/SCR
During a positive potential transient or other fault
condition, the fault currents from T
LINE
or R
LINE
,
limited by the break switches, are conducted through
switching power diodes from T
BAT
and R
BAT
to ground
via F
GND
. Both versions of the CPC7691 utilize a pair
State
IN
RINGING
Latch
T
SD
Timing
Break
Switches
Ringing
Return
Switch
(SW3)
Ringing
Switch
(SW4)
Ringing 1
0
Z-Off
On On
All-Off 1
0
Hold this state for one-half of the ringing cycle.
SW4 waiting for zero current to turn off.
Off Off
On
All-Off 0 Zero current has occurred. SW4 has opened Off Off Off
Talk 0 Z Close break switches
On Off Off
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CPC7691
of switching power diodes connected to F
GND
, one
from T
BAT
and the other from R
BAT
, oriented to forward
conduct whenever the potential at either T
BAT
or R
BAT
becomes positive with respect to F
GND
.
For negative potential fault situations, the CPC7691BA
utilizes a voltage fold-back SCR to direct fault currents
to F
GND
, away from the external devices, while the
CPC7691BB uses a pair of switching power diodes to
direct the fault currents to V
BAT
.
The SCR protection technique of the CPC7691BA
uses the V
BAT
supply as a reference and as a current
source for the SCR trigger to activate the SCR. During
a negative transient event resulting in a bias at T
BAT
or
R
BAT
of 2V to 4V more negative than V
BAT
, the SCR
conducts and faults are shunted to F
GND
. In order for
the SCR to crowbar (or foldback), the SCR’s
on-voltage (see “Protection Circuitry Electrical
Specifications” on page 8) must be less than the applied
voltage at the V
BAT
pin. If the V
BAT
voltage is less
negative than the SCR on-voltage, or if the V
BAT
supply is unable to source the trigger current, the SCR
will not crowbar.
Unlike the CPC7691BA which uses one-half of a
diode bridge and an SCR for the internal protection,
the CPC7691BB instead uses a full diode bridge to
clamp both polarities of a transient fault. In the
CPC7691BB a pair of power switching diodes are
used to direct excessive negative potentials at the
T
BAT
and R
BAT
nodes into V
BAT
. These diodes are
oriented so that anytime the potentials at the T
BAT
or
R
BAT
nodes become more negative than V
BAT
they
forward conduct.
Because these diodes direct negative potential faults
to the V
BAT
pin, the battery supply must be capable of
sourcing currents equal in magnitude to the total
currents of all simultaneous faults. As mentioned
earlier, the fault currents are restricted by the current
limits of the break switches.
Use of the CPC7691BA is recommended for
applications where the local V
BAT
supply is incapable
of sourcing the cumulative transient current demands
of simultaneous multiple port faults.
2.10.3 Thermal Shutdown
The thermal shutdown mechanism activates when the
device die temperature reaches a minimum of 110C,
placing the device in the All-Off state regardless of
logic input. During thermal shutdown events the T
SD
pin will output a logic low with a nominal 0V level. A
logic high is output from the T
SD
pin during normal
operation with a typical output level equal to V
DD
.
When presented with short duration transients such
as a lightning event, the thermal shutdown feature will
typically not activate. But in an extended power-cross
event, fault currents limited by the DC current limit
function flowing through the active switches will cause
the device temperature to rise until the thermal
shutdown mechanism activates. Activation of the
thermal shutdown mechanism forces the CPC7691
into the All-Off state. At this point the current
measured into T
LINE
or R
LINE
will drop to zero. Once
the device enters thermal shutdown it will remain in
the All-Off state until the device temperature drops
below the de-activation level of the thermal shutdown
circuit. This permits the device to autonomously return
to normal operation.
If the fault condition has not passed, the limited current
will again flow through the active switches and heating
will resume, reactivating the thermal shutdown
mechanism. This cycle of entering and exiting the
thermal shutdown mode will continue as long as the
fault condition persists. If the magnitude of the fault
condition is great enough, the external secondary
protector will activate shunting the fault current to
ground.
2.11 External Protection Elements
The CPC7691 requires only over-voltage secondary
protection on the loop (line) side of the device. The
integrated protection feature described above negates
the need for additional external protection on the SLIC
side. The secondary protector must limit voltage
transients to levels that do not exceed the breakdown
voltage or input-output isolation barrier of the
CPC7691. A foldback or crowbar type protector is
recommended to minimize stresses on the switches.
Consult IXYS Integrated Circuits Division’s application
note, AN-144, Impulse Noise Benefits of Line Card Access
Switches for equations related to the specifications of
external secondary protectors, fuse resistors and
PTCs.
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3. Manufacturing Information
3.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
CPC7691BA / CPC7691BB MSL 1
Device Maximum Temperature x Time
CPC7691BA / CPC7691BB 260°C for 30 seconds
e
3
Pb

CPC7691BATR

Mfr. #:
Manufacturer:
IXYS Integrated Circuits
Description:
Switch ICs - Various LCAS4 TTL Inputs Protection SCR
Lifecycle:
New from this manufacturer.
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