BTA16, BTB16, T1610, T1635 Characteristics
Doc ID 7471 Rev 9 5/10
Figure 11. D
2
PAK thermal resistance junction to ambient versus copper surface under tab
(printed circuit board FR4, copper thickness: 35 µm)
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal
Figure 8. Relative variation of gate trigger
current
0.01 0.10 1.00 10.00
100
1000
3000
I (A), I t (A s)
TSM
22
t (ms)
p
T initial=25°C
j
I
TSM
dI/dt limitation:
50A/µs
I t
2
pulse with width t < 10 ms and corresponding value of I t
p
2
-40 -20 0 20 40 60 80 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I,I[T] /
GTHL j
I ,I ,I [T =25°C]
GTHL j
I
GT
I
H
& I
L
holding current and latching current versus junction
temperature (typical values)
Figure 9. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 10. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
0.1 1.0 10.0 100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(dV/dt)c (V/µs)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
T1635/CW/BW
SW
C
B
Snubberless and Logic level types
0 25 50 75 100 125
0
1
2
3
4
5
6
(dI/dt)c [T ] / pecified]
j
(dI/dt)c [T s
j
T (°C)
j
Standard types
0 4 8 1216202428323640
0
10
20
30
40
50
60
70
80
S(cm²)
R (°C/W)
th(j-a)
DPAK
2
