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74HC05PW-Q100,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74HC05_Q100
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
.
2012. All rights rese
rved.
Product data sheet
Rev
.
1 — 9 July 2012
9 of 15
NXP Semiconductors
74HC05-Q100
Hex inverter with open-drain output
s
12. Package
outline
Fig 8.
Pac
kage outline SOT1
08-1 (SO14)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
7
8
1
14
y
076E06
MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
99-12-27
03-02-19
0
2.5
5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
74HC05_Q100
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
.
2012. All rights rese
rved.
Product data sheet
Rev
.
1 — 9 July 2012
10 of 15
NXP Semiconductors
74HC05-Q100
Hex inverter with open-drain output
s
Fig 9.
Pac
kage outline SOT402-1
(TSSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
74HC05_Q100
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
.
2012. All rights rese
rved.
Product data sheet
Rev
.
1 — 9 July 2012
1
1 of 15
NXP Semiconductors
74HC05-Q100
Hex inverter with open-drain output
s
Fig 10.
Package
outline SOT762-1 (DHVQFN1
4)
terminal 1
index area
0.5
1
A
1
E
h
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
3.1
2.9
D
h
1.65
1.35
y
1
2.6
2.4
1.15
0.85
e
1
2
0.30
0.18
0.05
0.00
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1
MO-241
- - -
- - -
0.5
0.3
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
26
13
9
8
7
1
14
X
D
E
C
B
A
02-10-17
03-01-27
terminal 1
index area
A
C
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74HC05PW-Q100,118
Mfr. #:
Buy 74HC05PW-Q100,118
Manufacturer:
Nexperia
Description:
Inverters 74HC05PW-Q100/TSSOP14/REEL 13
Lifecycle:
New from this manufacturer.
Delivery:
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