MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
______________________________________________________________________________________ 13
Applications Information
Running Burst Enable Single-Ended
With PECL signal levels, for single-ended operation of
burst enable, connect the BEN+ to the burst-enable
control. Connect a resistor (R
1
) from V
CC
to BEN- and
resistor (R
2
) from BEN- to ground. The parallel combi-
nation of R
1
and R
2
should be less than 1kΩ. Choose
the values of R
1
and R
2
to set the common-mode volt-
age in the range defined in the
Electrical
Characteristics
table (see Figure 6).
With LVTTL or LVCMOS signal levels, for single-ended
operation of burst enable connect a 3kΩ (R
4
) resistor
from the burst-enable signal to BEN+. Connect a 5kΩ
(R
3
) resistor from V
CC
to BEN+. Connect a 5kΩ resistor
(R
5
) from V
CC
to BEN- and a 9kΩ resistor (R
6
) from
BEN- to ground. For typical LVTTL or LVCMOS specifi-
cations of V
CC
to 2.0V for a high and 0.8V to 0V for a
low, the LVTTL or LVCMOS sources a maximum of
75µA and sinks a maximum of 500µA. See Figure 7 for
setting up the single-ended LVTTL or LVCMOS biasing
for burst enable.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3656 output pins and laser diode as close as
possible. Place a bypass capacitor as close as possi-
ble to each V
CC
connection. Take extra care to mini-
mize stray parasitic capacitance on the BIAS and MD
pins. Use good high-frequency layout techniques and
multilayer boards with uninterrupted ground planes to
minimize EMI and crosstalk.
Laser Safety and IEC825
Using the MAX3656 laser driver alone does not ensure
that a transmitter design is compliant with IEC825. The
entire transmitter circuit and component selections
must be considered. Each user must determine the
level of fault tolerance required by the application, rec-
ognizing that Maxim products are neither designed nor
authorized for use as components in systems intended
for surgical implant into the body, for applications
intended to support or sustain life, or for any other
application in which the failure of a Maxim product
could create a situation where personal injury or death
can occur.
Figure 7. Single-Ended LVTTL or LVCMOS Biasing for Burst
Enable
IN+
IN-
BEN+
BEN-
LVTTL OR LVCMOS HIGH
LVTTL OR LVCMOS LOW
V
CC
R
5
= 5kΩ
R
4
= 3kΩ
R
6
= 9kΩ
V
CC
R
3
= 5kΩ
MAX3656
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
14 ______________________________________________________________________________________
Functional Diagram
IN+
IN-
BEN+
BEN-
APC
R
BIASMAX
LONGB
R
APCSET
I
MOD
I
BIAS
OUT-
OUT+
BIAS+
BIAS-
MD
R
MODSET
MAX3656
EN FAIL
DAC DSP ASP
V
CC
L
P
R
COMP
V
CC
R
P
R
D
R
D
C
COMP
Chip Information
TRANSISTOR COUNT: 8153
PROCESS: SiGe BIPOLAR
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TQFN-EP T2444-3
21-0139 90-0021
MAX3656
155Mbps to 2.5Gbps Burst-Mode
Laser Driver
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
15
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0 3/03 Initial release
1 5/04 Added the lead-free package to the Ordering Information table 1
2 10/04
Added the package code for the lead-free package to the Ordering Information table;
updated the Operating Conditions table; updated the Running Burst Enable Singled-
Ended section; added the Design Example section; updated Figure 7; added the Burst
Enable Delay section; updated the Chip Topography diagram
1, 2, 11,
12, 14
3 7/10
Removed the dice and package code information from the Ordering Information table;
replaced the Typical Application Circuit; added the soldering temperature to the Absolute
Maximum Ratings section; updated the optical eye mask margins in the Electrical
Characteristics table; updated the optical eye diagrams and added 2.488Gbps eye
diagram in the Typical Operating Characteristics section; updated the descriptions for
pins 13 and 17 with diodes in the Pin Description table; removed redundant text in the
Detailed Description; replaced the Interfacing with Laser Diodes section; deleted the
bonding coordinates (Table 3 and Burst Enable Delay and Wire-Bonding Die sections);
replaced the Functional Diagram; deleted the Chip Topography section; added the
Package Information table
1, 2, 59,
11, 13, 14
4 9/10
Removed the operating junction temperature range from the Absolute Maximum Ratings
section; added a sentence stating the minimum R
BIASMAX
value to the Programming the
Bias Current section
2, 10

MAX3656EVKIT

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Fiber Optic Development Tools Eval Kit MAX3656 (155Mbps to 2.5Gbps Burst-Mode Laser Driver)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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