VS-20ETF02FP-M3, VS-20ETF04FP-M3, VS-20ETF06FP-M3
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Vishay Semiconductors
Revision: 15-Sep-17
2
Document Number: 96296
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ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average forward current I
F(AV)
T
C
= 51 °C, 180° conduction half sine wave 20
A
Maximum peak one cycle non-repetitive
surge current
I
FSM
10 ms sine pulse, rated V
RRM
applied 250
10 ms sine pulse, no voltage reapplied 300
Maximum I
2
t for fusing I
2
t
10 ms sine pulse, rated V
RRM
applied 316
A
2
s
10 ms sine pulse, no voltage reapplied 442
Maximum I
2
t for fusing I
2
t t = 0.1 ms to 10 ms, no voltage reapplied 4420 A
2
s
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop V
FM
20 A, T
J
= 25 °C 1.30
V
60 A, T
J
= 25 °C 1.67
Forward slope resistance r
t
T
J
= 150 °C 12.5 m
Threshold voltage V
F(TO)
T
J
= 150 °C 0.9 V
Maximum reverse leakage current I
RM
T
J
= 25 °C
V
R
= Rated V
RRM
0.1
mA
T
J
= 150 °C 5.0
RECOVERY CHARACTERISTICS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Reverse recovery time t
rr
I
F
at 20 A
pk
100 A/μs
25 °C
160 ns
Reverse recovery current I
rr
10 A
Reverse recovery charge Q
rr
1.25 μC
Snap factor S Typical 0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range
T
J
, T
Stg
-40 to +150 °C
Maximum thermal resistance,
junction to case
R
thJC
DC operation 2.5
°C/W
Maximum thermal resistance,
junction to ambient
R
thJA
62
Typical thermal resistance,
case to heatsink
R
thCS
Mounting surface, smooth, and greased 0.5
Approximate weight
2g
0.07 oz.
Mounting torque
minimum 6 (5)
kgf · cm
(lbf · in)
maximum 12 (10)
Marking device Case style 2L TO-220 FullPAK
20ETF02FP
20ETF04FP
20ETF06FP
I
FM
t
rr
dir
dt
I
RM(REC)
Q
rr
t
t
a
t
b