6/9/04
Page 7 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
NOTE
All dimensions are in inches (millimeters)
Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.300 (7.62)
TYP
0° to 15°
0.154 (3.90)
0.100 (2.54)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.300 (7.62)
TYP
0.405 (10.30)
MAX
0.315 (8.00)
MIN
0.016 (0.40) MIN
2
5
PIN 1
ID.
0.016 (0.41)
0.008 (0.20)
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
4
3
0.020 (0.51)
MIN
1
6
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.154 (3.90)
0.100 (2.54)
0.200 (5.08)
0.135 (3.43)
0.004 (0.10)
MIN
0.270 (6.86)
0.240 (6.10)
0.400 (10.16)
TYP
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.070
(
1.78
)
0.060
(
1.52
)
0.030
(
0.76
)
0.100
(
2.54
)
0.295
(
7.49
)
0.415
(
10.54
)
6/9/04
Page 8 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
ORDERING INFORMATION1
MARKING INFORMATION
Option Example Part Number Description
No Suffix MOC8111 Through Hole
S MOC8111S Surface Mount Lead Bend
SD MOC8111SD Surface Mount; Tape and Reel
W MOC8111W 0.4" Lead Spacing
300 MOC8111300 VDE 0884
300W MOC8111300W VDE 0884, 0.4" Lead Spacing
3S MOC81113S VDE 0884, Surface Mount
3SD MOC81113SD VDE 0884, Surface Mount, Tape and Reel
MOC8111
V XX YY K
1
2
6
43
5
Definitions
1Fairchild logo
2Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4Two digit year code, e.g., ‘03’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
6/9/04
Page 9 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (Black Package, No Suffix)
Carrier Tape Specifications
4.0 ± 0.1
Ø
1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.85 ± 0.20
0.1 MAX
10.30 ± 0.20
9.55 ± 0.20
Ø
1.6 ± 0.1
• Peak reflow temperature: 225° C (package surface temperature)
• Time of temperature higher than 183° C for 60–150 seconds
• One time soldering reflow is recommended
215°C, 10–30 s
225 C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Te mperature (°C)
Time above 183° C, 60–150 sec
Ramp up = 3
C/sec

MOC8111300

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
OPTOISOLATOR 5.3KV TRANS 6-DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union