IRF9383MTR1PBF

Typical values (unless otherwise specified)
Notes:
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET
®
Website.
Surface mounted on 1 in. square Cu board, steady state.
T
C
measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
DirectFET ISOMETRIC
Description
The IRF9383MTRPbF combines the latest HEXFET
®
P-Channel Power MOSFET Silicon technology with the advanced DirectFET
®
packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET
®
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or
convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET
®
package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
MX
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
DirectFET
®
P-Channel Power MOSFET
l Environmentaly Friendly Product
l RoHs Compliant Containing no Lead,
no Bromide and no Halogen
l Common-Drain P-Channel MOSFETs Provides
High Level of Integration and Very Low RDS(on)
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
Features and Benefits
Applications
l Isolation Switch for Input Power or Battery Application
l High Side Switch for Inverter Applications
2 4 6 8 10 12 14 16 18 20
-V
GS,
Gate -to -Source Voltage (V)
0
2
4
6
8
10
12
T
y
p
i
c
a
l
R
D
S
(
o
n
)
(
m
Ω
)
I
D
= -22A
T
J
= 25°C
T
J
= 125°C
0 20 40 60 80 100 120 140 160 180
Q
G
Total Gate Charge (nC)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
-
V
G
S
,
G
a
t
e
-
t
o
-
S
o
u
r
c
e
V
o
l
t
a
g
e
(
V
)
V
DS
= -24V
V
DS
= -15V
V
DS
= -6.0V
I
D
= -18A
V
DSS
V
GS
R
DS(on)
R
DS(on)
-30V max ±20V max
2.3mΩ@-10V 3.8mΩ@-4.5V
Q
g tot
Q
gd
Q
gs2
Q
rr
Q
oss
V
gs(th)
67nC 29nC 9.4nC 315nC 59nC -1.8V
Absolute Maximum Ratings
Parameter Units
V
DS
Drain-to-Source Voltage
V
GS
Gate-to-Source Voltage
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
DM
Pulsed Drain Current
V
A
Max.
-17
-160
-180
±20
-30
-22
SQ SX ST MQ MX MT MP MC
IRF9383MPbF
1
www.irf.com © 2015 International Rectifier Submit Datasheet Feedback June 2, 2015
DD
G
S
S
Form Quantity
IRF9383MTRPbF
DirectFET
®
Medium Can
Tape and Reel 4800
IRF9383MTR1PbF
DirectFET
®
Medium Can
Tape and Reel 1000 "TR1" suffix EOL notice #264
Orderable part number Package Type
Standard Pack
Note
www.irf.com © 2015 International Rectifier Submit Datasheet Feedback June 2, 2015
2
IRF9383MPbF
Pulse width 400μs; duty cycle 2%.
Notes:
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units
BV
DSS
Drain-to-Source Breakdown Voltage -30 ––– ––– V
ΔΒV
DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient ––– 0.0159 ––– V/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– 2.3 2.9
––– 3.8 4.8
V
GS(th)
Gate Threshold Voltage -1.3 -1.8 -2.4 V
Δ
V
GS(th)
/
Δ
T
J
Gate Threshold Voltage Coefficient ––– -5.9 ––– mV/°C
I
DSS
Drain-to-Source Leakage Current ––– ––– -1.0
––– ––– -150
I
GSS
Gate-to-Source Forward Leakage ––– ––– -100
Gate-to-Source Reverse Leakage ––– ––– 100
gfs Forward Transconductance 56 ––– ––– S
Q
g
Total Gate Charge ––– 130 –––
Q
g
Total Gate Charge ––– 67 –––
Q
gs1
Pre- Vth Gate-to-Source Charge ––– 12 –––
V
DS
= -15V
Q
gs2
Post -Vth Gate-to-Source Charge ––– 9.4 –––
V
GS
= -4.5V
Q
gd
Gate-to-Drain Charge ––– 29 –––
I
D
= -18A
Q
godr
Gate Charge Overdrive ––– 16.6 –––
See Fig.15
Q
sw
Switch charge (Q
gs2
+ Q
gd
)
––– 38.4 –––
Q
oss
Output Charge ––– 59 –––
nC
R
G
Gate Resistance ––– 6.5 –––
Ω
t
d(on)
Turn-On Delay Time ––– 29 –––
t
r
Rise Time ––– 160 –––
t
d(off)
Turn-Off Delay Time ––– 115 –––
t
f
Fall Time ––– 110 –––
C
iss
Input Capacitance ––– 7305 –––
C
oss
Output Capacitance ––– 1780 –––
C
rss
Reverse Transfer Capacitance ––– 1030 –––
Parameter Min. Typ. Max. Units
I
S
Continuous Source Current
(Body Diode)
I
SM
Pulsed Source Current
(Body Diode)
V
SD
Diode Forward Voltage ––– ––– -1.2 V
t
rr
Reverse Recovery Time ––– 52 78 ns
Q
rr
Reverse Recovery Charge ––– 315 470 nC
ns
pF
A
––– –––
––– –––
-114
-180
μA
mΩ
nA
nC
di/dt = 500A/μs
T
J
= 25°C, I
S
= -18A, V
GS
= 0V
showing the
integral reverse
p-n junction diode.
V
GS
= -4.5V, I
D
= -18A
T
J
= 25°C, I
F
= -18A, ,V
DD
= -15V
V
GS
= 0V
V
DS
= -15V
I
D
= -18A
V
DD
= -15V, V
GS
= -4.5V
V
DS
= V
GS
, I
D
= -150μA
V
DS
= -24V, V
GS
= 0V
V
GS
= -20V
V
GS
= 20V
Conditions
V
GS
= 0V, I
D
= -250μA
Reference to 25°C, I
D
= -1.0mA
V
GS
= -10V, I
D
= -22A
V
DS
= -24V, V
GS
= 0V
V
DS
= -24V, V
GS
= 0V, T
J
= 125°C
MOSFET symbol
R
G
= 1.8Ω
V
DS
= -10V, I
D
= -18A
Conditions
See Fig.17
ƒ = 1.0KHz
V
DS
= -15V, V
GS
= -10V, I
D
= -18A
G
D
S
www.irf.com © 2015 International Rectifier Submit Datasheet Feedback June 2, 20153
IRF9383MPbF
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
R
θ
is measured at T
J
of approximately 90°C.
Surface mounted on 1 in. square Cu
board (still air).
Mounted to a PCB with small
clip heatsink (still air)
Mounted on minimum footprint full size
board with metalized back and with small
clip heatsink (still air)
Used double sided cooling, mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Notes:
1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100 1000
t
1
, Rectangular Pulse Duration (sec)
0.0001
0.001
0.01
0.1
1
10
100
T
h
e
r
m
a
l
R
e
s
p
o
n
s
e
(
Z
t
h
J
A
)
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
Ri (°C/W) τi (sec)
2.7194 0.0138004
23.1599 55.766563
10.2579 0.6520047
23.6469 7.7259631
τ
J
τ
J
τ
1
τ
1
τ
2
τ
2
τ
3
τ
3
R
1
R
1
R
2
R
2
R
3
R
3
Ci= τi/Ri
Ci= τi/Ri
τ
A
τ
A
τ
4
τ
4
R
4
R
4
Absolute Maximum Ratings
Parameter Units
P
D
@T
A
= 25°C Power Dissipation
P
D
@T
A
= 70°C
Power Dissipation
P
D
@T
C
= 25°C Power Dissipation
T
P
Peak Soldering Temperature
T
J
Operating Junction and
T
STG
Storage Temperature Range
Thermal Resistance
Parameter Typ. Max. Units
R
θ
JA
Junction-to-Ambient ––– 60
R
θ
JA
Junction-to-Ambient 12.5 ––
R
θ
JA
Junction-to-Ambient 20 –– °C/W
R
θ
JC
Junction-to-Case , ––– 1.1
R
θ
J-PCB
Junction-to-PCB Mounted 1.0 –––
Linear Derating Factor
W/°C
W
°C
1.3
0.02
270
-40 to + 150
Max.
113
2.1

IRF9383MTR1PBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET P-CH -30V -160A 2.9mOhm -4.5V M-Can
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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