Package and PCB thermal data VNH5180A-E
22/31 Doc ID 17074 Rev 6
4 Package and PCB thermal data
4.1 PowerSSO-36 thermal data
Figure 15. PowerSSO-36™ PC board
VNH5180A-E Package and PCB thermal data
Doc ID 17074 Rev 6 23/31
Figure 16. Chipset configuration
Figure 17. Auto and mutual R
thj-amb
vs PCB copper area in open box free air
condition
4.1.1 Thermal calculation in clockwise and anti-clockwise operation in
steady-state mode
CHIP 1
R
thA
CHIP 2
CHIP 3
R
thB
R
thC
R
thAB
R
thAC
R
thBC
0
10
20
30
40
50
60
70
80
0123456789
cm
2
of Cu Area (refer to PCB layout)
°C/W
RthA
RthB = RthC
RthAB = RthAC
RthBC
Table 18. Thermal calculation in clockwise and anti-clockwise operation in steady-
state mode
HS
A
HS
B
LS
A
LS
B
T
jHSAB
T
jLSA
T
jLSB
ON OFF OFF ON
P
dHSA
x R
thHS
+ P
dLSB
x R
thHSLS
+ T
amb
P
dHSA
x R
thHSLS
+
P
dLSB
x R
thLSLS
+ T
amb
P
dHSA
x R
thHSLS
+ P
dLSB
x R
thLS
+ T
amb
OFF ON ON OFF
P
dHSB
x R
thHS
+ P
dLSA
x R
thHSLS
+ T
amb
P
dHSB
x R
thHSLS
+
P
dLSA
x R
thLS
+ T
amb
P
dHSB
x R
thHSLS
+ P
dLSA
x R
thLSLS
+ T
amb
Package and PCB thermal data VNH5180A-E
24/31 Doc ID 17074 Rev 6
4.1.2 Thermal calculation in transient mode
T
hs
= P
dhs
• Z
hs
+ Z
hsls
• (P
dlsA
+ P
dlsB
) + T
amb
T
lsA
= P
dlsA
• Z
ls
+ P
dhs
• Z
hsls
+ P
dlsB
• Z
hsls
+ T
amb
T
lsB
= P
dlsB
• Z
ls
+ P
dhs
• Z
hsls
+ P
dlsA
• Z
hsls
+ T
amb
Figure 18. Detailed chipset configuration
Equation 1: pulse calculation formula
where
CHIP 1
Z
ts
CHIP 2
CHIP 3
Z
ls
Z
ls
Z
hsls
Z
hsls
Z
lsls
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
δ t
p
T=

VNH5180A-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Motor / Motion / Ignition Controllers & Drivers Automotive H-Bridge 180mOhm 8A 41V VCC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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