List of figures VNH5180A-E
4/31 Doc ID 17074 Rev 6
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Definition of the delay times measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Definition of the low-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Definition of the high-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Definition of dynamic cross conduction current during a PWM operation. . . . . . . . . . . . . . 14
Figure 8. Definition of delay response time of sense current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Waveforms in full-bridge operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. Waveforms in full-bridge operation (continued) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 11. Typical application circuit for DC to 20 kHz PWM operation short circuit protection . . . . . 19
Figure 12. Behavior in fault condition (how a fault can be cleared) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 13. Half-bridge configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 14. Multi-motors configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 15. PowerSSO-36™ PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 16. Chipset configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 17. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . 23
Figure 18. Detailed chipset configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 19. PowerSSO-36 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 25
Figure 20. PowerSSO-36 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 25
Figure 21. Thermal fitting model of an H-bridge in PowerSSO-36. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 22. PowerSSO-36 TP package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 23. PowerSSO-36 TP tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 24. PowerSSO-36 TP tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
