Sensors
10 NXP Semiconductors
MMA26xx
2.7 Dynamic Electrical Characteristics - DSI
V
L
(V
CC
- V
SS
) V
H
, T
L
T
A
T
H
, ΔT 25 K/min, unless otherwise specified.
# Characteristic Symbol Min Typ Max Units
85
86
87
88
Reset Recovery (See Figure 21)
POR negated to 1st DSI Command (Initialization Command)
POR negated to Acceleration Data Valid (Including LPF Init)
DSI Clear Command to 1st DSI Command (Initialization Command)
DSI Clear Command to Acceleration Data Valid (Including LPF Init)
t
DSI_INIT
t
DSP_INIT
t
DSI_INIT
t
DSP_INIT
400 / f
OSC
400 / f
OSC
10000 / f
OSC
10000 / f
OSC
s
s
s
s
(7)
(7)
(7)
(7)
89
HCAP Under-Voltage Reset Delay (See Figure 6)
V
HCAP
< V
PORHCAP_f
to POR assertion t
HCAP_POR
880 / f
OSC
s(7)
90
V
REG
Under-Voltage Reset Delay (See Figure 7)
V
REG
< V
PORVREG_f
to POR assertion t
VREG_POR
⎯⎯ 5 μs(3)
91
V
REGA
Under-Voltage Reset Delay (See Figure 8)
V
REGA
< V
PORVREGA_f
to POR assertion t
VREGA_POR
⎯⎯ 5 μs(3)
92
93
94
V
REG
, V
REGA
Capacitor Monitor
POR to first Capacitor Test Disconnect
Disconnect Time ()
Disconnect Rate ()
t
POR_CAPTEST
t
CAPTEST_TIME
t
CAPTEST_RATE
12000 / f
OSC
6 / f
OSC
256 / f
OSC
s
s
s
(7)
(7)
(7)
95 Initialization to Bus Switch Closing t
BS
89 138 μs(7)
96
BUSOUT Discharge Resistance
Activation Time t
BUSOUT_Discharge
9.5 10 10.5 μs(3)
97 Communication Data Rate D
RATE
100 200 kbps (7)
98
Loss of Signal Reset Time
Maximum time below frame threshold t
TO
2.00 4.00 ms (7)
99
BUSIN Response Current Slew Rate
1.0 mA to 9.0 mA, 9.0 to 1.0 mA t
ITR
0.33 10.0 mA/μs(3)
100
101
BUSIN Timing to Response Current
BUSIN Negative Voltage Transition =3.0V to I
RSP
= 7.0 mA rise
BUSIN Negative Voltage Transition =3.0V to I
RSP
= 5.0 mA fall
t
RSP_R
t
RSP_F
2.50
2.50
μs
μs
(7)
(7)
102
103
DSI BUSIN Signal Duty Cycle
Logic ‘0’
Logic ‘1’
*
*
D
CL
D
CH
10
60
33
67
40
90
%
%
(7)
(7)
104
105
106
107
Inter-frame Separation Time (See Figure 9)
Following Read Write NVM Command
Following Initialization, BS = 1
Following Initialization, BS = 0
Following other DSI bus commands
t
IFS
t
IFS
t
IFS
t
IFS
12
200
20
20
ms
μs
μs
μs
(7)
(7)
(7)
(7)
108 DSI Data Latency t
LAT_DSI
4 / f
OSC
5 / f
OSC
s(7)
109
Bus Switch Open Time
Reset Asserted to I
SW_LEAK
20 μA
t
BSOPEN
⎯⎯500 μs(3)
110
111
112
113
114
115
Self-Test Response Time
Self-Test Activation time (EOF
Slave
to 90% ΔDFLCT_xxx, 180 Hz LPF)
Self-Test Deactivation time (EOF
Slave
to 10% ΔDFLCT_xxx, 180 Hz LPF)
Self-Test Activation time (EOF
Slave
to 90% ΔDFLCT_xxx, 400 Hz LPF)
Self-Test Deactivation time (EOF
Slave
to 10% ΔDFLCT_xxx, 400 Hz LPF)
Self-Test Activation time (EOF
Slave
to 90% ΔDFLCT_xxx, 800 Hz LPF)
Self-Test Deactivation time (EOF
Slave
to 10% ΔDFLCT_xxx, 800 Hz LPF)
t
ST_ACT_180
t
ST_DEACT_180
t
ST_ACT_400
t
ST_DEACT_400
t
ST_ACT_800
t
ST_DEACT_800
2.00
2.00
1.00
1.00
0.50
0.50
5.00
5.00
2.50
2.50
1.75
1.75
ms
ms
ms
ms
ms
ms
(7)
(7)
(7)
(7)
(7)
(7)
116
Error Detection Response Time
Mirror Register CRC Error to Status Flag (S) set (Factory or User Array) t
CRC_Err
75 / f
OSC
s(7)
Sensors
NXP Semiconductors 11
MMA26xx
2.8 Dynamic Electrical Characteristics - Signal Chain
V
L
(V
CC
- V
SS
) V
H
, T
L
T
A
T
H
, ΔT 25 K/min, unless otherwise specified.
Notes:
1. Parameters tested 100% at final test at -40°C, 25°C, and 105°C.
2. Parameters tested 100% at probe.
3. Verified by characterization.
4. * Indicates critical characteristic.
5. Verified by qualification testing, not tested in production.
6. Parameters verified by pass/fail testing in production.
7. Functionality guaranteed by modeling, simulation and/or design verification. Circuit integrity assured through IDDQ and scan testing. Timing
is determined by internal system clock frequency.
8. Verified by user system level characterization, not tested in production, or at component level.
9. Verified by Simulation.
10.Measured at final test. Self-test activation occurs under control of the test program.
11.Thermal resistance between the die junction and the exposed pad; cold plate is attached to the exposed pad.
12.Maximum voltage characterized. Minimum voltage tested 100% at final test. Maximum voltage tested 100% to 24 V at final test.
13.N/A.
14.Sensitivity, and overload capability specifications will be reduced when 800Hz filter is selected.
15.Filter cut-off frequencies are directly dependent upon the internal oscillator frequency.
16.Target values. Actual values to be determined during device characterization.
# Characteristic Symbol Min Typ Max Units
117 Internal Oscillator Frequency * f
OSC
3.80 4 4.20 MHz (1)
118 Data Interpolation Latency t
LAT_INTERP
64 / f
OSC
65 / f
OSC
s(7)
119
120
121
122
123
124
DSP Low-Pass Filter
Cutoff frequency LPF0 (referenced to 0 Hz)
Filter Order LPF0
Cutoff frequency LPF1 (referenced to 0 Hz)
Filter Order LPF1
Cutoff frequency LPF2 (referenced to 0 Hz)
Filter Order LPF2
f
C_LPF0
O
LPF0
f
C_LPF1
O
LPF1
f
C_LPF2
O
LPF2
171
380
760
180
2
400
4
800
4
189
420
840
Hz
1
Hz
1
Hz
1
(7)
(7)
(7)
(7)
(7)
(7)
125
126
Sensing Element Rolloff Frequency (-3db)
±25g, ±50g, ±62.5g, ±125g
±187g, ±312g
f
gcell_3dB_xlo
f
gcell_3dB_xhi
938
3952
2592
14370
Hz
Hz
(9)
(9)
127
128
Sensing Element Natural Frequency
±25g, ±50g, ±62.5g, ±125g
±187g, ±312g
f
gcell_xlo
f
gcell_xhii
12651
26000
13871
28700
Hz
Hz
(9)
(9)
129
130
Sensing Element Damping Ratio
±25g, ±50g, ±62.5g, ±125g
±187g, ±312g
ζ
gcell_xlo
ζ
gcell_xhi
2.760
1.260
6.770
3.602
(9)
(9)
131
132
Sensing Element Delay (@100Hz)
±25g, ±50g, ±62.5g, ±125g
±187g, ±312g
f
gcell_delay100_xlo
f
gcell_delay100_xhi
63
13
170
40
μs
μs
(9)
(9)
133 Package Resonance Frequency f
Package
100 ⎯⎯kHz (9)
Sensors
12 NXP Semiconductors
MMA26xx
Figure 6. V
HCAP
Under-Voltage Detection
Figure 7. V
REG
Under-Voltage Detection
Figure 8. V
REGA
Under-Voltage Detection
V
PORHCAP_r
V
HCAP
V
PORHCAP_f
V
HYST_HCAP
t
HCAP_POR
UV
UV: UNDER-VOLTAGE CONDITION
EXISTS
UV
POR
V
PORVREG_r
V
REG
V
PORVREG_f
V
HYST_VREG
POR
t
VREG_POR
V
PORVREGA_r
V
REGA
V
PORVREGA_f
V
HYST_VREGA
POR
t
VREGA_POR

MMA2612KGCWR2

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Accelerometers DSI2.5 Accelerometer, QFN 16
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet