MC100ES6221TB

Advanced Clock Drivers Devices
Freescale Semiconductor 7
MC100ES6221
Figure 3. MC100ES6221 Test Reference
Figure 4. MC100ES6221 AC Test Reference Measurement Waveform
Differential Pulse
Generator
Z = 50
R
T
= 50
Z
0
= 50
DUT
MC100ES6221
V
TT
R
T
= 50
Z
0
= 50
V
TT
t
PD
(CLK
N
to Q
X
)
V
CMR
= V
CC
– 1.3 V
V
PP
= 0.8 V
CLK
N
CLK
N
Q
X
Q
X
Advanced Clock Drivers Devices
8 Freescale Semiconductor
MC100ES6221
APPLICATIONS INFORMATION
Understanding the Junction Temperature Range of the
MC100ES6221
To make the optimum use of high clock frequency and low
skew capabilities of the MC100ES6221, the MC100ES6221
is specified, characterized and tested for the junction
temperature range of T
J
=0°C to +110°C. Because the exact
thermal performance depends on the PCB type, design,
thermal management and natural or forced air convection,
the junction temperature provides an exact way to correlate
the application specific conditions to the published
performance data of this data sheet. The correlation of the
junction temperature range to the application ambient
temperature range and vice versa can be done by
calculation:
T
J
= T
A
+ R
thja
P
tot
Assuming a thermal resistance (junction to ambient) of
17°C/W (2s2p board, 200 ft/min airflow, see Table 8) and a
typical power consumption of 1148 mW (all outputs
terminated 50 ohms to V
TT
, V
CC
= 3.3 V, frequency
independent), the junction temperature of the MC100ES6221
is approximately T
A
+ 21°C, and the minimum ambient
temperature in this example case calculates to
21°C (the
maximum ambient temperature is 89°C. See Table 8).
Exceeding the minimum junction temperature specification of
the MC100ES6221 does not have a significant impact on the
device functionality. However, the continuous use the
MC100ES6221 at high ambient temperatures requires
thermal management to not exceed the specified maximum
junction temperature. Please see the application note
AN1545 for a power consumption calculation guideline.
Maintaining Lowest Device Skew
The MC100ES6221 guarantees low output-to-output bank
skew of 50 ps and a part-to-part skew of max. 270 ps. To
ensure low skew clock signals in the application, both outputs
of any differential output pair need to be terminated
identically, even if only one output is used. When fewer than
all nine output pairs are used, identical termination of all
output pairs within the output bank is recommended. This will
reduce the device power consumption while maintaining
minimum output skew.
Power Supply Bypassing
The MC100ES6221 is a mixed analog/digital product. The
differential architecture of the MC100ES6221 supports low
noise signal operation at high frequencies. In order to
maintain its superior signal quality, all V
CC
pins should be
bypassed by high-frequency ceramic capacitors connected
to GND. If the spectral frequencies of the internally generated
switching noise on the supply pins cross the series resonant
point of an individual bypass capacitor, its overall impedance
begins to look inductive and thus increases with increasing
frequency. The parallel capacitor combination shown ensures
that a low impedance path to ground exists for frequencies
well above the noise bandwidth.
Figure 5. V
CC
Power Supply Bypass
Table 8. Ambient Temperature Ranges (P
tot
= 1148 mW)
R
thja
(2s2p board)
T
A, min
(1)
1. The MC100ES6221 device function is guaranteed from
T
A
= –40°C to T
J
= 110°C
T
A, max
Natural convection 20°C/W –23 °C87°C
100 ft/min 18°C/W –21 °C89°C
200 ft/min 17°C/W –20 °C90°C
400 ft/min 16°C/W –18 °C92°C
800 ft/min 15°C/W –17 °C93°C
V
CC
MC100ES6221
V
CC
33...100 nF 0.1 nF
Advanced Clock Drivers Devices
Freescale Semiconductor 9
MC100ES6221
APPLICATIONS INFORMATION
Using the Thermally Enhanced Package of the
MC100ES6221
The MC100ES6221 uses a thermally enhanced exposed
pad (EP) 52 lead LQFP package. The package is molded so
that the lead frame is exposed at the surface of the package
bottom side. The exposed metal pad will provide the low
thermal impedance that supports the power consumption of
the MC100ES6221 high-speed bipolar integrated circuit and
eases the power management task for the system design. A
thermal land pattern on the printed circuit board and thermal
vias are recommended in order to take advantage of the
enhanced thermal capabilities of the MC100ES6221. Direct
soldering of the exposed pad to the thermal land will provide
an efficient thermal path. In multilayer board designs, thermal
vias thermally connect the exposed pad to internal copper
planes. Number of vias, spacing, via diameters and land
pattern design depend on the application and the amount of
heat to be removed from the package. A nine thermal via
array, arranged in a 3 x 3 array and using a 1.2 mm pitch in
the center of the thermal land is a requirement for
MC100ES6221 applications on multi-layer boards. The
recommended thermal land design comprises a 3 x 3 thermal
via array as shown in Figure 6, providing an efficient heat
removal path.
Figure 6. Recommended Thermal Land Pattern
The via diameter is should be approx. 0.3 mm with 1 oz.
copper via barrel plating. Solder wicking inside the via
resulting in voids during the solder process must be avoided.
If the copper plating does not plug the vias, stencil print solder
paste onto the printed circuit pad. This will supply enough
solder paste to fill those vias and not starve the solder joints.
The attachment process for exposed pad package is
equivalent to standard surface mount packages. Figure 7
shows a recommend solder mask opening with respect to the
recommended 3 x 3 thermal via array. Because a large solder
mask opening may result in a poor release, the opening
should be subdivided as shown in Figure 7. For the nominal
package standoff 0.1 mm, a stencil thickness of 5 to 8 mils
should be considered.
Figure 7. Recommended Solder Mask Openings
For thermal system analysis and junction temperature
calculation the thermal resistance parameters of the package
is provided:
It is recommended that users employ thermal modeling
analysis to assist in applying the general recommendations
to their particular application. The exposed pad of the
MC100ES6221 package does not have an electrical low
impedance path to the substrate of the integrated circuit and
its terminals. The thermal land should be connected to GND
through connection of internal board layers.
4.8
Thermal via array (3x3),
1.2 mm pitch,
0.3 mm diameter
Exposed pad
land pattern
all units mm
4.8
Table 9. Thermal Resistance
(1)
1. Applicable for a 3 x 3 thermal via array.
ConvectionL
FPM
R
THJA
(2)
°C/W
2. Junction to ambient, four conductor layer test board (2S2P), per
JES51–7 and JESD 51–5.
R
THJA
(3)
°C/W
3. Junction to ambient, single layer test board, per JESD51–3.
R
THJC
°C/W
R
THJB
(4)
°C/W
4. Junction to board, four conductor layer test board (2S2P) per
JESD 51–8.
Natural 20 48
4
(5)
29
(6)
5. Junction to exposed pad.
6. Junction to top of package.
16
100 18 47
200 17 46
400 16 43
800 15 41
Exposed pad land
pattern
4.8
Thermal via array (3x3),
1.2 mm pitch,
0.3 mm diameter
1.0
0.2
all units mm
4.8
1.0
0.2

MC100ES6221TB

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC CLK BUFFER 2:20 2GHZ 52LQFP
Lifecycle:
New from this manufacturer.
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