BYV34X-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 13 September 2007 3 of 9
NXP Semiconductors
BYV34X-600
Dual rectifier diode ultrafast
5. Thermal characteristics
6. Isolation characteristics
Table 4. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-h)
thermal resistance from junction to
heatsink
with heatsink compound;
per diode; see
Figure 1
- - 5.0 K/W
with heatsink compound;
both diodes conducting
- - 4.0 K/W
without heatsink compound;
per diode
- - 7.0 K/W
R
th(j-a)
thermal resistance from junction to
ambient
in free air - 55 - K/W
Fig 1. Transient thermal impedance from junction to heatsink as a function of pulse width
001aaf033
1
10
−1
10
Z
th(j-h)
(K/W)
10
−3
10
−2
t
p
(s)
10
−6
10110
−1
10
−5
10
−3
10
−2
10
−4
t
p
t
p
T
P
t
T
δ =
Table 5. Isolation limiting values and characteristics
T
h
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage from all terminals to external heatsink;
f = 50 Hz to 60 Hz; sinusoidal waveform;
relative humidity ≤ 65 %; clean and dust free
- - 2500 V
C
isol
isolation capacitance from cathode to external heatsink; f = 1 MHz - 10 - pF