BUK661R9-40C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 18 August 2010 3 of 15
NXP Semiconductors
BUK661R9-40C
N-channel TrenchMOS intermediate level FET
4. Limiting values
[1] Accumulated pulse duration not to exceed 5mins.
[2] -16V accumulated duration not to exceed 168 hrs
[3] Continuous current is limited by package.
[4] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[5] Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[6] Refer to application note AN10273 for further information.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage T
j
25 °C; T
j
175 °C - 40 V
V
GS
gate-source voltage Pulsed
[1]
-20 20 V
DC
[2]
-16 16 V
I
D
drain current T
mb
=2C; V
GS
=10V; see Figure 1
[3]
- 120 A
T
mb
=10C; V
GS
= 10 V; see Figure 1
[3]
- 120 A
I
DM
peak drain current T
mb
=2C; t
p
10 µs; pulsed;
see Figure 3
-1107A
P
tot
total power dissipation T
mb
=2C; see Figure 2 - 306 W
T
stg
storage temperature -55 175 °C
T
j
junction temperature -55 175 °C
Source-drain diode
I
S
source current T
mb
=2C
[3]
- 120 A
I
SM
peak source current t
p
10 µs; pulsed; T
mb
=2C - 1107 A
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-source
avalanche energy
I
D
=120A; V
sup
40 V; R
GS
=50;
V
GS
=10V; T
j(init)
= 25 °C; unclamped
-1.02J
E
DS(AL)R
repetitive drain-source
avalanche energy
[4][5][6]
--J
BUK661R9-40C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 18 August 2010 4 of 15
NXP Semiconductors
BUK661R9-40C
N-channel TrenchMOS intermediate level FET
Fig 1. Continuous drain current as a function of
mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
003aac385
0
100
200
300
0 50 100 150 200
T
mb
(
°
C)
I
D
(A)
(1)
T
mb
(°C)
0 20015050 100
03na19
40
80
120
P
der
(%)
0
003aae247
10
-1
1
10
10
2
10
3
10
4
10
-1
1 10 10
2
V
DS
(V)
I
D
(A)
Limit R
DSon
= V
DS
/ I
D
DC
100 ms
10 ms
1 ms
100
μ
s
t
p
=10
μ
s
BUK661R9-40C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 18 August 2010 5 of 15
NXP Semiconductors
BUK661R9-40C
N-channel TrenchMOS intermediate level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting base
see Figure 4 --0.49K/W
R
th(j-a)
thermal resistance from
junction to ambient
vertical in free air - 60 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
003aae269
single shot
δ
= 0.5
0.2
0.1
0.05
0.02
10
-3
10
-2
10
-1
1
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
t
p
(s)
Z
th(j-mb)
(K/W)
t
p
T
P
t
t
p
T
δ =

BUK661R9-40C,118

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET N-CHAN 40V 120A
Lifecycle:
New from this manufacturer.
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