VN5R003H-E Package and PC board thermal data
Doc ID 17602 Rev 6 13/20
Figure 9. HPAK thermal impedance junction ambient single pulse
Figure 10. Thermal fitting model of a single-channel HSD in HPAK

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     
7LPHV
=7+&:
&X FP
&X FP
&X IRRWSULQW
*$3*&)7
GAPGCFT 00133
Note:
The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections
(power limitation or thermal cycling during thermal shutdown) are not triggered.
Package and PC board thermal data VN5R003H-E
14/20 Doc ID 17602 Rev 6
Equation 1: pulse calculation formula
where δ = t
P
/T
Table 9. Thermal parameter
Area/island (cm
2
)Footprint48
R1 (°C/W) 0.01
R2 (°C/W) 0.15
R3 (°C/W) 1
R4 (°C/W) 8
R5 (°C/W) 28 21 12
R6 (°C/W) 31 24 16
C1 (W.s/°C) 0.005
C2 (W.s/°C) 0.05
C3 (W.s/°C) 0.08
C4 (W.s/°C) 0.4
C5 (W.s/°C) 0.8 1.4 3
C6 (W.s/°C) 3 6 9
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
VN5R003H-E Package and packing information
Doc ID 17602 Rev 6 15/20
5 Package and packing information
5.1 ECOPACK
®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
5.2 HPAK mechanical data
Figure 11. HPAK package dimension
GAPGCFT00134

VN5R003H-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution 3mOhm Reverse Battery Prot Switch
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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