HMC470A-EP Enhanced Product
Rev. 0 | Page 8 of 8
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.80
1.70 SQ
1.60
1
0.50
BSC
BOTTOM VIEWTOP VIEW
SIDE VIEW
16
5
8
9
12
13
4
0.05 MAX
0.02 NOM
0.203 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.90
0.85
0.80
0.45
0.40
0.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-23-2017-A
PKG-005376
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-4
EXPOSED
PAD
PIN 1
INDIC
A
T
OR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
SEATING
PLANE
Figure 10. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.85 mm Package Height
(CP-16-51)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description
Package
Option Branding
16-Lead Lead Frame Chip Scale Package [LFCSP]
HMC470ATCPZ-EP-RL7 −55°C to +125°C MSL3 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-51 Y6U
1
The HMC470ATCPZ-EP-PT and the HMC470ATCPZ-EP-RL7 models are RoHS Compliant.
2
See the Absolute Maximum Ratings section.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16364-0-10/17(0)