TC429
DS21416D-page 10 2002-2012 Microchip Technology Inc.
The device capacitive load dissipation is:
EQUATION
Quiescent power dissipation depends on input signal
duty cycle. A logic low input results in a low-power
dissipation mode with only 0.5 mA total current drain.
Logic-high signals raise the current to 5 mA maximum.
The quiescent power dissipation is:
EQUATION
Transition power dissipation arises because the output
stage N- and P-channel MOS transistors are ON
simultaneously for a very short period when the output
changes.
The device transition power dissipation is approxi-
mately:
EQUATION
An example shows the relative magnitude for each
item.
TABLE 4-1: MAXIMUM OPERATING
FREQUENCIES
FIGURE 4-5: Peak Output Current
Capability.
4.5 POWER-ON OSCILLATION
Power-on oscillations are due to trace size, layout and
component placement. A ‘quick fix’ for most applica-
tions that exhibit power-on oscillation problems is to
place approximately 10 k in series with the input of
the MOSFET driver.
C = 2500 pF
V
S
= 15V
D = 50%
f = 200 kHz
P
D
= Package power dissipation:
= P
C
+ P
T
+ P
Q
= 113 mW + 10 mW + 41 mW
= 164 mW
Maximum ambient operating temperature:
= T
J
JA
(P
D
)
= 150ºC - (150ºC/W)(0.164W)
= 125C
Where:
T
J
= Maximum allowable junction temperature
(+150C)
JA
= Junction-to-ambient thermal resistance
(150C/W, CERDIP)
P
C
fCV
S
2
=
Where:
f = Switching frequency
C = Capacitive load
V
S
= Supply voltage
P
Q
V
S
DI
H
 1DI
L
+=
Where:
I
H
= Quiescent current with input high
I
L
= Quiescent current with input low
D = Duty cycle
(5 mA max)
(0.5 mA max)
P
T
fV
S
3.3 10
9
ASec=
Note: Ambient operating temperature should not
exceed +85ºC for EPA or EOA devices or
+125ºC for MJA devices.
V
S
f
MAX
18V 500 kHz
15V 700 kHz
10V 1.3 MHz
5V >2 MHz
Conditions:
1. CERDIP Package (
JA
=150C/W)
2. T
A
= +25C
3. C
L
= 2500 pF
Note: It is extremely important that all MOSFET
driver applications be evaluated for the
possibility of having high-power oscillations
occur during the power-on cycle.
TIME (5μs/DIV)
V
S
= 18V
R
L
= 0.1Ω
5V
INPUT
OUTPUT
5μs
500mV
5V/DIV
500mV/DIV
(5 AMP/DIV)
2002-2012 Microchip Technology Inc. DS21416D-page 11
TC429
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
XXXXXXXX
NNN
YYWW
8-Lead PDIP (300 mil)
Example:
TC429CPA
057
0350
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
TC429
EOA0350
057
8-Lead CERDIP (300 mil)
Example:
XXXXXXXX
NNN
YYWW
TC429MJA
057
0350
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
TC429
DS21416D-page 12 2002-2012 Microchip Technology Inc.
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
E
eB
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
88
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
c
.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
a
51015 51015
Mold Draft Angle Bottom
b
51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

TC429EPA

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Gate Drivers 6A Power
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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