MAX5078
4A, 20ns, MOSFET Driver
7
Maxim Integrated
MAX5078 toc22
40ns/div
LOGIC-INPUT VOLTAGE vs. OUTPUT VOLTAGE
(V
DD
= 15V, C
L
= 10,000pF)
IN+ = V
DD
IN-
2V/div
OUT
5V/div
MAX5078B (TTL INPUT)
V
DD
vs. OUTPUT VOLTAGE
MAX5078 toc23
2ms/div
V
DD
5V/div
OUT
5V/div
IN+ = 15V
IN- = GND
C
L
= 10,000pF
MAX5078B (TTL INPUT)
MAX5078 toc24
2ms/div
V
DD
vs. OUTPUT VOLTAGE
IN+ = 15V
IN- = GND
C
L
= 10,000pF
V
DD
5V/div
OUT
5V/div
MAX5078B (TTL INPUT)
Typical Operating Characteristics (continued)
(T
A
= +25°C, unless otherwise noted.)
MAX5078 toc21
20ns/div
LOGIC-INPUT VOLTAGE vs. OUTPUT VOLTAGE
(V
DD
= 15V, C
L
= 5000pF)
IN-
2V/div
OUT
5V/div
IN+ = V
DD
MAX5078B (TTL INPUT)
MAX5078
4A, 20ns, MOSFET Driver
8
Maxim Integrated
Detailed Description
V
DD
Undervoltage Lockout (UVLO)
The MAX5078A/MAX5078B have internal undervoltage
lockout (UVLO) for V
DD
. When V
DD
is below the UVLO
threshold, OUT is pulled low independent of the state of
the inputs. The undervoltage lockout is typically 3.5V with
200mV typical hysteresis to avoid chattering. When V
DD
rises above the UVLO threshold, the output goes high or
low depending upon the logic-input levels. Bypass V
DD
using a low-ESR ceramic capacitor for proper operation
(see the
Applications Information
section).
Logic Inputs
The MAX5078A has CMOS logic inputs while the
MAX5078B has TTL-compatible logic inputs. The logic
inputs are protected against the voltage spikes up to
18V, regardless of the V
DD
voltage. The TTL and CMOS
logic inputs have 300mV and 0.1 x V
DD
hysteresis,
respectively, to avoid double pulsing during transition.
The low 2.5pF input capacitance reduces loading and
increases switching speed.
The logic inputs are high impedance and must not be left
floating. If the inputs are left open, OUT can go to an
undefined state as soon as V
DD
rises above the UVLO
threshold. Therefore, the PWM output from the controller
must assume proper state when powering up the device.
The MAX5078A/MAX5078B have two logic inputs, provid-
ing greater flexibility in controlling the MOSFET. Use IN+
for noninverting logic and IN- for inverting logic operation.
Connect IN+ to V
DD
and IN- to GND, if not used.
Alternatively, the unused input can be used as an
ON/OFF function. Use IN+ for active-low shutdown logic
and IN- for active-high shutdown logic (see Figure 3). See
Table 1 for all possible input combinations.
Driver Output
The MAX5078A/MAX5078B have low R
DS(ON)
p-channel
and n-channel devices (totem pole) in the output stage
for the fast turn-on/turn-off, high-gate-charge switching
MOSFETs. The peak source or sink current is typically
4A. The output voltage (V
OUT
) is approximately equal to
V
DD
when in high state and is ground when in low state.
The driver R
DS(ON)
is lower at higher V
DD
resulting in
higher source-/sink-current capability and faster switch-
ing speeds. The propagation delays from the noninvert-
ing and inverting logic inputs to OUT are matched to 2ns
typically. The break-before-make logic avoids any cross-
conduction between the internal p- and n-channel
devices, and eliminates shoot-through, thus reducing the
quiescent supply current.
Applications Information
RLC Series Circuit
The driver’s R
DS(ON)
(R
ON
), internal bond/lead induc-
tance (L
P
), trace inductance (L
S
), gate inductance (L
G
),
and gate capacitance (C
G
) form a series RLC
circuit with a second-order characteristic equation. The
series RLC circuit has an undamped natural frequency
(ϖ
0
) and a damping ratio (ζ) where:
The damping ratio needs to be greater than 0.5 (ideally
1) to avoid ringing. Add a small resistor (R
GATE
) in
series with the gate when driving a very low gate-
charge MOSFET, or when the driver is placed away
from the MOSFET.
ϖ
ξ
0
1
2
=
++ ×
=
×
++
()
()
LLL C
R
LLL
C
PSG G
ON
PSG
G
Pin Description
PIN NAME FUNCTION
1 IN- Inverting Logic-Input Terminal. Connect to GND when not used.
2, 3 GND Ground
4V
DD
Power Supply. Bypass to GND with one or more 0.1µF ceramic capacitors.
5 OUT Driver Output. Sources or sinks current to turn the external MOSFET on or off.
6 IN+ Noninverting Logic-Input Terminal. Connect to V
DD
when not used.
—EP
Exposed Pad. Internally connected to GND. Do not use the exposed pad as the only electrical
ground connection.
MAX5078
4A, 20ns, MOSFET Driver
9
Maxim Integrated
Use the following equation to calculate the series resistor:
L
P
can be approximated as 2nH for the TDFN package.
L
S
is on the order of 20nH/in. Verify L
G
with the MOS-
FET vendor.
Supply Bypassing and Grounding
Pay extra attention to bypassing and grounding the
MAX5078A/MAX5078B. Peak supply and output currents
may exceed 4A when driving large external capacitive
loads. Supply voltage drops and ground shifts create
negative feedback for inverters and may degrade the
delay and transition times. Ground shifts due to poor
device grounding may also disturb other circuits sharing
the same AC ground return path. Any series inductance
in the V
DD
, OUT, and/or GND paths can cause oscilla-
tions due to the very high di/dt when switching the
MAX5078A/MAX5078B with any capacitive load. Place
one or more 0.1µF ceramic capacitors in parallel as close
to the device as possible to bypass V
DD
to GND. Use a
ground plane to minimize ground return resistance and
series inductance. Place the external MOSFET as close
as possible to the MAX5078A/MAX5078B to further mini-
mize board inductance and AC path impedance.
Power Dissipation
Power dissipation of the MAX5078A/MAX5078B consists
of three components: caused by the quiescent current,
capacitive charge/discharge of internal nodes, and the
output current (either capacitive or resistive load).
Maintain the sum of these components below the maxi-
mum power dissipation limit.
The current required to charge and discharge the inter-
nal nodes is frequency dependent (see the I
DD-SW
Supply Current vs. Supply Voltage graph in the
Typical
Operating Characteristics
). The power dissipation (P
Q
)
due to the quiescent switching supply current (I
DD-SW
)
can be calculated as:
P
Q
= V
DD
x I
DD-SW
For capacitive loads, use the following equation to esti-
mate the power dissipation:
P
CLOAD
= C
LOAD
x (V
DD
)
2
x f
SW
where C
LOAD
is the capacitive load, V
DD
is the supply
voltage, and f
SW
is the switching frequency.
Calculate the total power dissipation (P
T
) as follows:
P
T
= P
Q
+ P
CLOAD
Use the following equations to estimate the MAX5078A/
MA5078B total power dissipation when driving a ground-
referenced resistive load:
P
T
= P
Q
+ P
RLOAD
P
RLOAD
= D x R
ON(MAX)
x I
LOAD
2
where D is the fraction of the period the MAX5078A/
MA5078B’s output pulls high, R
ON(MAX)
is the maximum
on-resistance of the device with the output high, and
I
LOAD
is the output load current of the MAX5078A/
MAX5078B.
Layout Information
The MAX5078A/MAX5078B MOSFET drivers source and
sink large currents to create very fast rising and falling
edges at the gate of the switching MOSFET. The high
di/dt can cause unacceptable ringing if the trace
lengths and impedances are not well controlled.
R
LLL
C
R
GATE
PSG
G
ON
++
()
V
IH
V
IL
90%
10%
V
IH
V
IL
t
R
t
F
t
D-OFF1
t
D-ON1
t
D-OFF2
t
D-ON2
IN+
OUT
IN-
RISING MISMATCH = t
D-ON2
- t
D-ON1
FALLING MISMATCH = t
D-OFF2
- t
D-OFF1
Figure 1. Timing Diagram
P
N
MAX5078A
MAX5078B
BREAK-
BEFORE-
MAKE
CONTROL
V
DD
OUT
GND
IN-
IN+
Figure 2. MAX5054 Simplified Diagram (1 Driver)

MAX5078AATT+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Gate Drivers 4A 20ns MOSFET Driver
Lifecycle:
New from this manufacturer.
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