NCP304, NCP305
www.onsemi.com
21
PACKAGE DIMENSIONS
SC−82AB
SQ SUFFIX
CASE 419C−02
ISSUE F
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.30
0.0512
ǒ
mm
inches
Ǔ
SCALE 10:1
0.65
0.026
1.90
0.075
0.90
0.035
0.70
0.028
0.95
0.037
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
12
3
A
G
S
N
J
K
4
D3 PL
B
F
L
C
H
0.05 (0.002)
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 1.80 2.20 0.071 0.087
B 1.15 1.35 0.045 0.053
C 0.80 1.10 0.031 0.043
D 0.20 0.40 0.008 0.016
F 0.30 0.50 0.012 0.020
G 1.10 1.50 0.043 0.059
H 0.00 0.10 0.000 0.004
J 0.10 0.26 0.004 0.010
K 0.10 −−− 0.004 −−−
L 0.05 BSC 0.002 BSC
N 0.20 REF 0.008 REF
S 1.80 2.40 0.07 0.09
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NCP304/D
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