AD5116 Data Sheet
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
V
to GND –0.3 V to +7.0 V
V
, V
, V
to GND GND − 0.3 V to V
+ 0.3 V
I
A
, I
W
, I
B
Pulsed
Frequency > 10 kHz
R
AW
= 5 kΩ and 10 kΩ ±6 mA/d
AW
±1.5 mA/d
Frequency ≤ 10 kHz
R
AW
= 5 kΩ and 10 kΩ
±6 mA/√d
2
AW
±1.5 mA/√d
Continuous
R
= 5 kΩ and 10 kΩ ±6mA
R
AW
= 80 kΩ ±1.5mA
DD
(whichever is less)
Operating Temperature Range
−40°C to +125°C
Maximum Junction Temperature (T
Max) 150°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time At Peak Temperature 20 sec to 40 sec
Package Power Dissipation (T
max − T
)/θ
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
Pulse duty factor.
3
Includes programming of EEPROM memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is defined by JEDEC specification JESD-51, and the value is
dependent on the test board and test environment.
Table 5. Thermal Resistance
Package Type θ
θ
Unit
8-Lead LFCSP 90
1
25 °C/W
1
JEDEC 2S2P test board, still air (0 m/sec air flow).
ESD CAUTION
