PBSS9110Y_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 22 November 2009 3 of 13
NXP Semiconductors
PBSS9110Y
100 V, 1 A PNP low V
CEsat
(BISS) transistor
5. Limiting values
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.
[2] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 1cm
2
collector mounting
pad.
[3] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 6cm
2
collector mounting
pad.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 120 V
V
CEO
collector-emitter voltage open base - 100 V
V
EBO
emitter-base voltage open collector - 5V
I
CM
peak collector current T
j(max)
- 3A
I
C
collector current (DC) - 1A
I
B
base current (DC) - 0.3 A
P
tot
total power dissipation T
amb
25 °C
[1]
-290mW
[2]
480 mW
[3]
625 mW
T
j
junction temperature - 150 °C
T
amb
operating ambient
temperature
65 +150 °C
T
stg
storage temperature 65 +150 °C
(1) 1cm
2
collector mounting pad
(2) Standard footprint
Fig 1. Power derating curves
T
amb
(°C)
0 16012040 80
001aaa796
200
400
600
P
tot
(mW)
0
(1)
(2)
PBSS9110Y_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 22 November 2009 4 of 13
NXP Semiconductors
PBSS9110Y
100 V, 1 A PNP low V
CEsat
(BISS) transistor
6. Thermal characteristics
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint
[2] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 1cm
2
collector mounting pad.
[3] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 6cm
2
collector mounting pad.
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient in free air
[1]
431 K/W
[2]
260 K/W
[3]
200 K/W
R
th(j-s)
thermal resistance from junction to
soldering
in free air
[1]
85 K/W
Mounted on FR4 PCB; standard footprint
(1) δ =1
(2) δ =0.75
(3) δ =0.5
(4) δ =0.33
(5) δ =0.2
(6) δ =0.1
(7) δ =0.05
(8) δ =0.02
(9) δ =0.01
(10) δ =0
Fig 2. Transient thermal impedance as a function of pulse time; typical values
001aaa798
10
1
10
2
10
3
Z
th
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
(9)
(8)
(7)
(6)
(5)
(4)
(1)
(10)
(3)
(2)
PBSS9110Y_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 22 November 2009 5 of 13
NXP Semiconductors
PBSS9110Y
100 V, 1 A PNP low V
CEsat
(BISS) transistor
Mounted on FR4 PCB; mounting pad for collector = 1cm
2
(1) δ =1
(2) δ =0.75
(3) δ =0.5
(4) δ =0.33
(5) δ =0.2
(6) δ =0.1
(7) δ =0.05
(8) δ =0.02
(9) δ =0.01
(10) δ =0
Fig 3. Transient thermal impedance as a function of pulse time; typical values
001aaa797
10
1
10
2
10
3
Z
th
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
(9)
(8)
(7)
(6)
(5)
(4)
(1)
(10)
(2)
(3)

PBSS9110Y,115

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT TRANS BISS TAPE-7
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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