PMPB29XPEA
20 V, P-channel Trench MOSFET
27 March 2018 Product data sheet
1. General description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power
DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench
MOSFET technology.
2. Features and benefits
Low threshold voltage
Trench MOSFET technology
Side wettable flanks for optical solder inspection
ElectroStatic Discharge (ESD) protection > 2 kV HBM (class H2)
AEC-Q101 qualified
3. Applications
Relay driver
High-speed line driver
High-side load switch
Switching circuits
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
DS
drain-source voltage - - -20 V
V
GS
gate-source voltage
T
j
= 25 °C
-12 - 12 V
I
D
drain current V
GS
= -4.5 V; T
amb
= 25 °C [1] - - -5 A
Static characteristics
R
DSon
drain-source on-state
resistance
V
GS
= -4.5 V; I
D
= -5 A; T
j
= 25 °C - 28 32.5
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm
2
.
Nexperia
PMPB29XPEA
20 V, P-channel Trench MOSFET
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 D drain
2 D drain
3 G gate
4 S source
5 D drain
6 D drain
7 D drain
8 S source
6
5
7
8
4
Transparent top view
1
2
3
DFN2020MD-6 (SOT1220)
017aaa259
G
D
S
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
PMPB29XPEA DFN2020MD-6 DFN2020MD-6: plastic thermal enhanced ultra thin small outline
package; no leads; 6 terminals
SOT1220
7. Marking
Table 4. Marking codes
Type number Marking code
PMPB29XPEA 4L
PMPB29XPEA All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2018. All rights reserved
Product data sheet 27 March 2018 2 / 14
Nexperia
PMPB29XPEA
20 V, P-channel Trench MOSFET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage - -20 V
V
GS
gate-source voltage
T
j
= 25 °C
-12 12 V
V
GS
= -4.5 V; T
amb
= 25 °C [1] - -5 AI
D
drain current
V
GS
= -4.5 V; T
amb
= 100 °C [1] - -3.2 A
I
DM
peak drain current T
amb
= 25 °C; single pulse; t
p
≤ 10 µs - -12 A
T
amb
= 25 °C [1] - 1.7 WP
tot
total power dissipation
T
sp
= 25 °C - 12.5 W
T
j
junction temperature -55 150 °C
T
amb
ambient temperature -55 150 °C
T
stg
storage temperature -65 150 °C
Source-drain diode
I
S
source current T
amb
= 25 °C [1] - -1.8 A
ESD maximum rating
V
ESD
electrostatic discharge
voltage
HBM [2] - 2000 V
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-
source avalanche
energy
T
j(init)
= 25 °C; I
D
= -2.1 A; DUT in
avalanche (unclamped)
- 22.1 mJ
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm
2
.
[2] Measured between all pins.
PMPB29XPEA All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2018. All rights reserved
Product data sheet 27 March 2018 3 / 14

PMPB29XPEAX

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET PMPB29XPEA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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